A method for manufacturing a substrate with a transparent conductive film, includes emitting subnano-to-nanosecond laser light to a transparent conductive film formed on a surface of a substrate to form a laser-induced periodic surface structure having a corrugated shape in at least a part of the transparent conductive film.

A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.

A printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first and second circuit patterns has a first side surface, a second side surface opposing the first side surface, and a top surface connected to ends of the first and second side surfaces, when viewed in a cross section direction. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.

A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.

Even in the case where an underlayer differs or a film thickness varies, high-quality repair is allowed to be performed.

When a laser repair method performs repair work by setting a laser irradiation area for a defect part of a multi-layer film substrate and irradiating the defect part with a laser beam under a set laser working condition, the laser repair method includes: identifying a peripheral region of a laser beam irradiation position; dividing the identified peripheral region into a plurality of divided regions for each common reflected light information; inferring a layer structure at the laser beam irradiation position from analogy based on an arrangement pattern of the divided regions positioned around the laser beam irradiation position; and setting the laser working condition of the laser beam to be emitted based on the layer structure inferred from analogy.

The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

A combined flashing and electrical junction box system includes an enclosure subsystem and an expanse subsystem. Preferably, the enclosure subsystem and said expanse subsystem are both fireproof and waterproof.

The present invention relates to an electrochemical or chemical treatment device for high aspect ratio circuit board with through hole comprises: an electroplating tank; a solution storage tank; a positioning frame, the positioning frame fixes the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board; a priming piping sucking solution from the solution storage tank to the solution accumulated area; a suction cap corresponding to the suction area; and a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and further having a better result of electroplating the bore of through hole of the high aspect ratio circuit board.

A method for manufacturing a substrate with a transparent conductive film, includes emitting subnano-to-nanosecond laser light to a transparent conductive film formed on a surface of a substrate to form a laser-induced periodic surface structure having a corrugated shape in at least a part of the transparent conductive film.