A position detection sensor includes a plurality of position detection loop coils formed on a board made of resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder. Each of the position detection loop coils includes a plurality of first portions that extend on a first surface of the board in a first direction and a plurality of second portions that extend on a second surface of the board in a second direction that is orthogonal to the first direction. The wiring path pattern is disposed on the first surface and the second surface in a connector section that connects the position detection loop coils to external circuitry. The position detection sensor is capable of maintaining accuracy even though the loop coils are formed on the board by the thermal treatment using copper paste.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A sensor device includes an emitter configured to emit radiation a detector configured to detect radiation reflected from an object and a cover having an interior surface facing the emitter or detector and allowing the radiation to pass through the cover. The sensor device also includes a heater with a wire-like trace directly deposited on the interior surface of the cover formed of a fluid comprising an electrically conductive material that was deposited onto a portion of the cover and cured. The heater has an electrically conductive connector pad formed with the heater by directly depositing and curing the fluid comprising the electrically conductive material directly on the interior surface of the cover simultaneously with forming the heater. The heater is positioned and arranged to sufficiently heat the cover while not blocking an area through which radiation must pass for proper operation of the emitter and the detector.

A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

A squeegee drip collection system is configured to receive assembly material from at least one squeegee blade of the print head assembly. The squeegee drip collection system includes a paste shield coupled to the print head gantry and configured to be moved between a retracted position in which the paste shield is spaced from the at least one squeegee blade and an extended position in which the paste shield is positioned under the at least one squeegee blade. The squeegee drip collection system further includes a paste shield removal assembly configured to uncouple the paste shield from the print head gantry and to remove the paste shield.

A component mounting method includes an application step of applying a specific solder paste including Sn and a metal other than Sn to a board; a disposition step of positioning and disposing an upper surface reference type component having a positioning reference on an upper surface with respect to one or more reference points on the board; and a reflow step of reflow-soldering the component by heating the board, in which in the specific solder paste, at least a part of the Sn is melted, and molten Sn and the metal other than Sn form an intermetallic compound in the reflow step, thereby fixing the upper surface reference type component to the board.

The disclosure is directed to a printed circuit board for mechanical support and electrical connection of electrical or electronic components. The printed circuit board has conductive tracks and contact pads carved away or etched from at least one sheet layer of copper laminated onto a non-conductive substrate and has a label attached to the printed circuit board at an intended position before the assembly process. Soldering defects often occur due to the deposition of excessive amounts of solder paste on the contact pads of components adjacent to the label. To prevent soldering defects caused by incorrect solder paste application quantities by simple and inexpensive means, the printed circuit board provides the intended position of the label as a depression with respect to the surroundings thereof.

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate and 0.1-10 wt % of a polymeric binder, or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate and 0.25-10 wt % of a polymeric binder, and balance of at least one organic solvent, wherein the binder has ethyl cellulose, and the ethyl cellulose has an average weight molecular weight in a range of 60,000-95,000 g/mol and a bimodal molecular weight distribution.

Various systems, devices, and methods for a vehicle smart brake pad comprising a sensor such as a force sensing device, and a production process thereof. For example, a production process of a vehicle brake pad can include the following steps in time sequence: applying an electrical circuit a support plate; screen printing on the electrical circuit of at least a first electrode; screen printing on the at least first electrode of a sheet of piezoelectric material; screen printing on the sheet of at least a second electrode; applying a friction pad on the support plate; and bulk polarizing the sheet of piezoelectric material by a supply of power to the at least first and second electrodes.