Patent classifications
H05K3/1233
PRINTING DEVICE, SOLDER MANAGEMENT SYSTEM, AND PRINTING MANAGING METHOD
A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.
Conductive ball mounting device
A conductive ball mounting device is provided. The conductive ball mounting device includes: a mask having a thickness equal to or larger than a diameter of a conductive ball and having an opening formed therein, wherein the conductive ball is absorbed and desorbed into and from the opening; a frame having a vacuum hole formed therein and formed to enclose sides and an upper portion of the mask; and a porous member formed between the frame and the upper portion of the mask.
Method of manufacturing light-emitting module and light-emitting module
A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
Supply unit, printing device, and method for controlling printing device
The supply unit is used in a printing device to perform a print process of a viscous fluid on a printing target to supply the viscous fluid. The supply unit includes an attachment section to and from which a cartridge accommodating the viscous fluid is attachable or detachable, a restricting wall section configured to cover the cartridge and restrict access to an inside of the printing device, and a driving section configured to move the cartridge attached to the attachment section and the restricting wall section in a supply operation direction.
Screen printing machine, electronic component mounting system, and screen printing method
A screen printing machine for forming a print of paste supplied to a mask plate having pattern holes, includes: a flexible filling squeegee which performs a squeegeeing operation in which the filling squeegee is moved relative to the mask plate in a printing direction; and a scraping squeegee which is held to maintain a given interval from the filling squeegee in the printing direction and to be movable together with the filling squeegee in the printing direction, and which scraps off the paste remaining on the mask plate after passage of the filling squeegee. In the squeegeeing operation, the filling squeegee is pushed up and bent by the paste to provide a clearance between a bottom end of the filling squeegee and the mask plate with the paste interposed therebetween so that the pattern holes are filled with paste with a prescribed filling pressure.
SOLDER INSPECTION APPARATUS AND METHOD OF GENERATING FEEDBACK INFORMATION OF SOLDER INSPECTION APPARATUS
A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.
A STENCIL PRINTING MACHINE
The present application relates to a stencil printing machine, which comprises a first holder device (110), a mobile device (121), two support tables (131, 132) and two driving devices (151, 152), wherein the first holder device (110) is configured to be able to horizontally reciprocate in the portrait orientation, the mobile device (121) is mounted on the first holder device (110) and is configured to be able to horizontally reciprocate in the landscape orientation on the first holder device (110), the two support tables (131, 132) are mounted at the lower end of the mobile device (121) and are used to bear corresponding solder paste jars (141, 142), the two driving devices (151, 152) are mounted on the mobile device (121) so that each of the two driving devices (151, 152) is located above a corresponding support table (131, 132) and is used to press a corresponding solder paste jar (141, 142), and the mobile device (121) is configured to be able to drive the two support tables (131, 132) and the two driving devices (151, 152) to reciprocate vertically. Two standard solder paste jars (141, 142) can be assembled for the stencil printing machine provided by the present application. When one solder paste jar (141, 142) is empty, solder paste supply is switched to the other solder paste jar (141, 142) and the stencil printing machine can continue to operate without stopping, thus improving the working efficiency of the stencil printing machine significantly.
ISOLATED PRINT MEDIUM DISPENSER
A printing machine includes a sliding carriage to provide isolation between internal volumes, to enable a print medium container to be exchanged without disrupting a print operation. Convective air flow between the volumes is maintained during normal operation.
MODULAR SQUEEGEE HEAD APPARATUS FOR PRINTING MATERIALS
Described is an apparatus which comprises: a squeegee head which is operable to drop a material; and a vacuum manifold attachable to the squeegee head, wherein the vacuum manifold is operable to create a vacuum in a space prior to the squeegee head is to drop the material.
Paste dispensing transfer system and method for a stencil printer
A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.