In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A printing apparatus for printed electronics according to the present invention may include: ejection head units which each have at least one nozzle for ejecting ink droplets to perform drop-on-demand or continuous printing; a jetting observation unit which is provided at one side of the nozzle and configured to observe the ink droplet ejected from the nozzle; a lighting unit which is provided at the other side of the nozzle and configured to provide light to the jetting observation unit; an alignment observation unit which is configured to observe an aligned state between the nozzle and a substrate; and a fluid supply unit which is configured to supply the ink to the nozzle, in which the ejection head units include a single-nozzle head unit, and a multi-nozzle head unit provided separately from the single-nozzle head unit.

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method of producing a foil formed member, includes: preparing a formed member on which a plastic toner image having plasticity is formed; and pressing foil against the formed member at a temperature of 70 C. or lower to form a foil image on the plastic toner image of the formed member, and a method of producing a wiring substrate, includes: preparing a substrate on which a toner image of a toner, in which a volume fraction of particles having a particle diameter of 16 m or more is less than 1%, is formed; and forming a foil image on the toner image of the substrate.

A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 m to 2 m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method for forming on a substrate (108; 214) a pattern of a material, the method comprising: providing (S100) a material layer (104); providing (S104, S106) an adhesive layer (106), wherein at least one of the material layer (104) or the adhesive layer (106) comprises a pattern corresponding to the pattern to be formed on the substrate (108; 214); and transferring (S108) the material to the substrate (108; 214) with the adhesive fixing the material to a surface (110; 216) of the substrate (108; 214). This solves the problem of forming on a substrate a pattern of a material that, in general, cannot be applied to the substrate directly due to the fact that the material cannot be printed and/or has no or reduced adherence properties with respect to the substrate.

Electrically conductive electrostatic ink compositions are disclosed. In an 5 example, an electrically conductive electrostatic ink composition can comprise: a liquid carrier; and particles dispersed in the liquid carrier. The particles dispersed in the liquid carrier can comprise: thermoplastic resin, and electrically conductive metal particles. The electrically conductive metal particles can comprise: a core comprising a first metal, and a shell comprising a second 10 metal. The shell can enclose the core at least partially. The first metal and the second metal may not be the same.