A gravure printing plate capable of printing straight image lines with high accuracy. The gravure printing plate is a gravure printing plate for printing an image line including a straight image line constituted by a first contour line and a second contour line. The gravure printing plate includes a cell group including a reference cell for printing the first contour line, and image line composition cells present in a projection portion in which the reference cell is projected up to the second contour line in a direction orthogonal to the first contour line. The dimension of each cell of the reference cell and the image line composition cells in the same cell group in an extension direction of the first contour line is within ±5% of an arithmetic average value of the reference cell and the image line composition cells in the same cell group.

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

A reliable electronic circuit board is provided, which maintains the quality and electrical conduction of an electronic circuit thereof even if being produced at an ordinary temperature at an atmospheric pressure. The electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A metal pattern forming method has: producing a first base having a pattern of lyophilic portions which have lyophilic properties with respect to a liquid containing a metal component and liquid-repellent portions which have liquid-repellent properties with respect to the liquid containing a metal component; producing a second base which holds the liquid containing a metal component; and transferring the liquid containing a metal component from the second base to the lyophilic portions of the first base by bringing the first base and the second base into contact with each other. With the metal pattern forming method, it is possible to form a metal pattern with high accuracy in which the metal is prevented from adhering to an unnecessary position on the base.

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.

A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.