A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.

Provided are a surface-treated glass cloth that enables the reliability of a printed wiring board to be improved, a prepreg, and a printed wiring board. In the surface-treated glass cloth, a surface-treated layer contains a silane coupling agent, the amount of carbon attached of an adhering component of the surface-treated layer is in the range of 0.030 to 0.060% by mass, the arithmetic average height of the surface of the adhering component of the surface-treated layer is in the range of 1.0 to 3.0 nm, and the product of the amount of carbon attached of the adhering component and the arithmetic average height of the surface of the adhering component is in the range of 0.060 to 0.100.

An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

Embodiments directed at the design of an optically-enabled server based on using carbon nanotube based non-volatile memory and eliminating hard drives and/or solid-state drives. The disclosed optically-enabled server houses a plurality of blade servers connected to one another via high-speed optical interconnects instead of copper-based interconnects. In some embodiments, the high-speed optical interconnects include an optical interface generated from mating an electrical mezzanine connector included within an input/output interconnect module with corresponding mezzanine slots located on the motherboard of a blade server such that the optical interface provides the optical pathways for routing optical signals (between the plurality of blade servers and one or more external devices) generated using light of multiple wavelengths. In some embodiments, the disclosed design advantageously provides a 100-fold speed advantage over a single conventional optical blade edge server and a 3-fold energy savings over standard DDR4 Synchronous Dynamic Random-Access Memory (SDRAM) memory of the same size.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

A system such as a vehicle may have windows. A window may have rigid clear layers such as layers of glass or rigid polymer. A polymer layer may be interposed between the rigid clear layers to form a laminated window structure. A conductive layer such as a silver layer or other metal layer in the window may be configured to block infrared light. The conductive layer may be patterned to form signal paths, a radio-transparent region, and other structures in a window. The conductive layer may be formed as a coating on a rigid clear window layer or may be formed on other window structures. The conductive layer may be patterned by removing conductive material from areas of the conductive layer. An insulating layer that visually matches the conductive layer may be formed in these areas without overlapping the conductive area.

Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.