A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.

A electronic component including a first protective layer covering the substrate and the conductive tract, a second protective layer covering at least a portion of the first protective layer, wherein the second protective layer includes Parylene, and a third protective layer covering at least a portion of the second protective layer.

An insulating sheet for use in forming an insulating layer of an interconnect substrate includes a semi-cured insulating resin layer, a semi-cured protective resin layer laminated on an upper surface of the insulating resin layer, and a cover layer laminated on an upper surface of the protective resin layer, wherein the protective resin layer has lower resistance to a predetermined solution than the insulating resin layer has, the predetermined solution being capable of dissolving the insulating resin layer and/or the protective resin layer.

An implantable array, such as an electrode array, is provided. The array is suitable for being placed in anatomic tissue of a human or animal body, and has a structure for referencing predefined distinct points of the implantable electrode array in magnetic resonance images. A structure is arranged in a predefined portion of the implantable array, where the structure has multiple patterns, each pattern having a predefined form and formed from a material having a magnetic susceptibility which is different from the magnetic susceptibility of the anatomic tissue surrounding the implantable array when placed in the human or animal body. Each pattern is in a predefined spatial relationship with one of the predefined distinct points.

A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.

The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

A method of removing a conformal coating from a circuit board coated with said conformal coating, the method comprising: subjecting the circuit board to a jet comprising dry-ice ejected from a nozzle, to remove said conformal coating from said circuit board.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

A lighted accessory for a motor vehicle includes a machined aluminum body. The body includes a front wall that has a plurality of openings through it and a cavity behind it. A plurality of lenses are potted in place within the openings. LED lights are installed on the aluminum body in alignment with the lenses. Additional potting compound is applied to cover the LEDs and substantially fill the cavity. A faulty LED board may be replaced by removing a portion of the potting compound and the faulty LED board, replacing the faulty LED board with an operable one, and refilling the removed portion of the potting compound with additional potting compound.