Provided are a circuit board component and a terminal. The circuit board component includes: a circuit board and a wire disposed on the circuit board, where the wire includes a first portion and a second portion, a line width of the first portion is greater than or equal to a line width threshold, and a line width of the second portion is less than the line width threshold.

A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

A backplane connector includes a housing and a number of terminal modules assembled to the housing. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space. The terminal module includes a first signal terminal and a second signal terminal. The housing includes a number of insulating protrusions integrally extending from the base. The insulating protrusions extend into the receiving space. The terminal modules are assembled in the insulating protrusions. Compared with the prior art, the insulating protrusions of the present disclosure is integrally formed with the base, thereby improving the structural strength of the housing and improving the durability of the backplane connector.

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

Current measurement devices for printed circuit board mounting are disclosed herein. The current measurement devices include a hollow and flexible core to improve response to a primary signal and decrease weight. The current measurement device includes a housing with guides to maintain alignment of the core. An electromagnetic shield may be placed between the circumference of the core and the housing. The housing may include apertures to facilitate washing. The current measurement device may include a primary conductor external to the housing.

A backplane connector includes a housing and a number of terminal modules. Each terminal module includes a number of conductive terminals, a metal shield surrounding member, a first metal shield and a second metal shield. The conductive terminal includes a mating portion and a tail portion. The conductive terminals include a first signal terminal and a second signal terminal. The metal shield surrounding member surrounds the mating portions of the first signal terminal and the second signal terminal. The first metal shield and the second metal shield are in contact with the metal shield surrounding member. As a result, the shielding area is increased and the shielding effect is improved.

A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.