The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A position detection sensor includes a plurality of position detection loop coils formed on a board made of resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder. Each of the position detection loop coils includes a plurality of first portions that extend on a first surface of the board in a first direction and a plurality of second portions that extend on a second surface of the board in a second direction that is orthogonal to the first direction. The wiring path pattern is disposed on the first surface and the second surface in a connector section that connects the position detection loop coils to external circuitry. The position detection sensor is capable of maintaining accuracy even though the loop coils are formed on the board by the thermal treatment using copper paste.

A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

A module that improves heat-dissipation efficiency and can prevent a warp and a deformation of the module is provided. A module includes a substrate, a first component mounted on an upper surface of the substrate, a heat-dissipation member, and a sealing resin layer that seals the first component and the heat-dissipation member. The heat-dissipation member is formed to be larger than the area of the first component when viewed in a direction perpendicular to the upper surface of the substrate and prevents heat generation of the module by causing the heat generated from the first component to move outside the module. The heat-dissipation member has through holes, and the through holes are packed with a resin, which can prevent the sealing resin layer from peeling off.

A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.

A printed circuit board (PCB) comprises a blind via and a discrete component vertically embedded within the blind via.

By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.

The disclosure is directed to a printed circuit board for mechanical support and electrical connection of electrical or electronic components. The printed circuit board has conductive tracks and contact pads carved away or etched from at least one sheet layer of copper laminated onto a non-conductive substrate and has a label attached to the printed circuit board at an intended position before the assembly process. Soldering defects often occur due to the deposition of excessive amounts of solder paste on the contact pads of components adjacent to the label. To prevent soldering defects caused by incorrect solder paste application quantities by simple and inexpensive means, the printed circuit board provides the intended position of the label as a depression with respect to the surroundings thereof.

A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.