H05K3/3447

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENT, AND PRINTED CIRCUIT BOARD WITH ELECTRONIC COMPONENT
20230045335 · 2023-02-09 · ·

Provided is a method for manufacturing a printed circuit board with electronic component; including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.

Electrical assembly

An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket.

Terminal module and backplane connector having the terminal module

A terminal module includes a number of conductive terminals. The conductive terminals include a first signal terminal and a second signal terminal. A contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The first contact arm includes a first contact end portion and a first contact arm body portion connected with the first contact end portion. The first contact arm body portion includes a first end connected to the first contact end portion and a second end opposite to the first end. From the first end to the second end, a width of the first contact arm body portion gradually increases. As a result, it is beneficial to improve the contact impedance when it is mated with a mating backplane connector. The present disclosure also discloses a backplane connector having the terminal module.

Terminal module and backplane connector having the terminal module

A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.

Backplane connector with improved structure strength

A backplane connector includes a housing and a number of terminal modules assembled to the housing. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space. The terminal module includes a first signal terminal and a second signal terminal. The housing includes a number of insulating protrusions integrally extending from the base. The insulating protrusions extend into the receiving space. The terminal modules are assembled in the insulating protrusions. Compared with the prior art, the insulating protrusions of the present disclosure is integrally formed with the base, thereby improving the structural strength of the housing and improving the durability of the backplane connector.

Through-hole and surface mount printed circuit card connections for improved power component soldering

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Multi-core cable assembling method and multi-core cable assembly producing method

An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.

PLUG-IN CONNECTOR DEVICE AND METHOD FOR PRODUCING A PLUG-IN CONNECTOR DEVICE OF THIS KIND
20230029329 · 2023-01-26 ·

A plug-in connector device has a printed circuit board element, a first plug-in connector element which is electrically and mechanically connected to the printed circuit board element by a soldered connection, and a second plug-in connector element which is electrically and mechanically connected to the printed circuit board element by electrical press-in contacts. The second plug-in connector element has a housing section with a recess in which the first plug-in connector element is arranged in such a way that outer surfaces of the first plug-in connector element make contact with inner surfaces of the recess.

CONNECTOR-MOUNTED BOARD MANUFACTURING METHOD AND ELECTRONIC UNIT
20230021587 · 2023-01-26 · ·

Provided is a connector-mounted board manufacturing method for manufacturing a connector-mounted board, the connector-mounted board including a circuit board, on which a terminal and an electronic component are mounted, and a connector housing attached to the terminal. The connector-mounted board manufacturing method includes: executing a mounting process of mounting the terminal and the electronic component on the circuit board; and executing an attaching process of attaching the connector housing to the terminal after the mounting process has been executed.

Battery pack and method of manufacture

A battery pack comprises a set of battery cells, a battery cell holder holding the battery cells, at least one battery strap having a first end connected to a terminal of one of the battery cells and a second end extending from the battery cell holder, a printed circuit board having a first side and a second side, components mounted on the second side of the printed circuit board, a trace on the second side of the printed circuit board extending from one components to a contact connected to the trace and mated with the second end of the at least one battery strap. Multiple vias extend from the first side to the second side, and the contact comprises a first portion having a through hole and a leg integrally formed with and approximately perpendicular to the first portion, the leg extending from the first side of the PCB to the second side of the PCB through a first via, the trace extending from the first via, the leg soldered to the second side of the PCB and the via and the through hole aligned with a second via adjacent to the first via, the through hole sized and configured to receive a PCB end of the strap, the PCB end of the strap soldered to the contact.