A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.

The manufacturing method includes (a) preparing first printed circuit board and second printed circuit board, the first printed circuit board being provided with a plurality of first terminals, the second printed circuit board being provided with a plurality of second terminals, and the first terminals or the second terminals being coated with solders; and (b) connecting the first terminals and the second terminals, respectively, via respective solders by performing thermocompression on connecting portions of the first printed circuit board and the second printed circuit board. Each second terminal includes a first end portion and a second end portion in a long axis direction, and in the step (b), pressure is applied to each second terminal such that the height of each of the first end portion and second end portion is larger than the height in another portion of the second terminal.

There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

In a leaded electronic component mounting structure in which the effect of reducing the occurrence of a blow hole is not impaired even if resin of a lead-inserted component is softened by heat during soldering and which can reduce a load placed on a lead when an external force acts, the lead of the lead-inserted component is inserted into a through hole provided in a base material of a printed wiring board, soldering is performed by immersing into molten solder, and a surface mount component and a surface mount component pad form an air vent tunnel. The air vent tunnel does not come into direct contact with the lead-inserted component, and therefore is not blocked even if the resin of the lead-inserted component softens due to soldering. Thus, the effect of reducing the occurrence of a blow hole is not impaired.

An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.

A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.