A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

The present disclosure provides a flexible circuit board, a driving structure and a display device. The flexible circuit board includes: a base plate, including a bonding region and a first routing region between the bonding region and the first edge, touch lines and shielding lines on the base plate and insulated and spaced from each other, and the touch lines includes a first routing portion in the first routing region; wherein the flexible circuit board further includes: a first shielding layer electrically connected to the shielding lines and insulated and spaced from the touch lines, wherein the first shielding layer is in the first routing region and on a side of the first routing portion distal to the base plate, and an orthographic projection of the first shielding layer on the base plate covers an orthographic projection of the first routing portion on the base plate.

A mounting substrate manufacturing apparatus includes a first FPC-side pressing member 51 configured to press and heat a first mounting component group 31 including one edge side mounting component that is a flexible printed circuit board 13 arranged on one edge in an arrangement direction in which flexible printed circuit boards 13 arranged on an array substrate 11B and thermally press and bond the first mounting component group 31 on the array substrate 11B, and a second FPC-side pressing member 52 arranged next to the first FPC-side pressing member 51 in the arrangement direction and configured to press and heat a second mounting component group 32 including all the flexible printed circuit boards 13 except for the first mounting component group 31 and thermally press and bond the second mounting component group 32 on the array substrate 11B.

A thin, flexible computerized sensing platform which can be affixed to a structure to be sensed, which has excellent mechanical coupling between the sensors and the object to be sensed, which can be self-powered and rechargeable, and which can be environmentally sealed, and a method for assembling and utilizing the same.

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.

A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.