Electrical connection system comprising a primary connection device and a secondary connection device, the primary connection device comprising a shielded cap and primary conductive contacts which extend at least partially inside the shielded cap, the secondary connection device comprising a secondary electrical board which has a secondary mass surface, secondary conductive contacts which extend from an installation surface of the secondary electrical board which is surrounded by the secondary mass surface, and a resilient conductive material which is attached to the secondary mass surface, the electrical connection system being arranged so that the primary conductive contacts are electrically connected to the secondary electrical contacts inside the shielded cap and the shielded cap extends on the resilient conductive material by compressing it.

An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.

A system for the assembly of circuit boards is shown. The system includes an assembly device and a circuit board. The assembly device comprises a substantially planar base plate and guide members. The circuit board includes multiple rigid portions connected by flexible members. The guide members extend into a space partially or completely enclosed in the horizontal direction by the circuit board, and determine the position and orientation of the rigid portions relative to the base plate.

A lighting device contains a first circuit board and a second circuit board. The first circuit board has one or more connecting sections having overall at least two contact areas. The second circuit board has an opening through which the connecting section of the first circuit board can extend. At least two contact elements, which are electrically connected to conductive tracks of the second circuit board, are arranged on the second circuit board. Each contact element has a contact region by which the contact element butts against one of the contact areas of the first circuit board. As a result, an electrical connection is produced between the two circuit boards.

Examples of card fasteners and assemblies for fastening cards to printed circuit boards are discussed. A card fastener comprises a frame comprising a first arm, a second arm, and an intermediate portion joining the first arm and the second arm. A compressive pad is attached to the intermediate portion. The first arm and second arm are to couple to hooks on a printed circuit board of a device and the compressive pad is to come in contact with the card.

A hob apparatus includes a sensor unit configured to detect a sensor signal, an electronic signal processing unit configured to further process and/or analyze the sensor signal, and a printed circuit board, on which the sensor unit and the signal processing unit are arranged together.

An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

Semiconductor light emitting device includes: substrate including main and back surfaces, first and second side surfaces, and bottom and top surfaces, wherein main surface includes first to fourth sides; first main surface electrode on main surface and including first base portion contacting the sides of the main surface, and die pad connected to first base portion; second main surface electrode disposed on the main surface and including second base portion contacting first and third sides of the main surface, and wire pad connected to second base portion; semiconductor light emitting element including first electrode pad and mounted on die pad; wire connecting first electrode pad and wire pad; first insulating film covering portion between first base portion and die pad; second insulating film covering portion between second base portion and wire pad and having end portions contacting main surface; and light-transmitting sealing resin.

A memory module operation system for operating in high stress environments with strong vibration. The application and use of a retainer to reduce and dampen the effects of system vibration and the application of dynamic loads can retain a memory module in place in a memory socket. Further, the retainer can operate to reduce the effects of electromagnetic interference and can act as a heat transport system to reduce thermal stress on components.