A laminate that includes a substrate made of a polyolefin-based resin and is excellent in adhesion between the substrate and a metal plating layer is provided in a simple manner without roughening the surface of the substrate. In addition, a molded article, a printed wring board, and an electromagnetic wave shield using the laminate using the same are provided. Used is a laminate configured such that on a substrate (A) made of a polyolefin-based resin (a), a primer layer (B) containing a polyolefin-based resin (b) that is organic solvent soluble or water dispersible, a metal particle layer (C), and a metal plating layer (D) are sequentially laminated.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterized by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterized by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.

A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.

The invention relates to thin metal electrode films for use in high-performance device systems comprising: a substrate; an underlayer; and a primer layer coated with metal coating. The thin metal electrode film has metal wiring with high resolution on a substrate and thus has excellent electrical properties. The invention also relates to a method for manufacturing thin metal electrode film.

A printed circuit board includes a first insulating layer; a first circuit pattern embedded in the first insulating layer; a second insulating layer disposed on the first insulating layer; a via hole penetrating at least a portion of each of the first and second insulating layers; and an adhesive layer disposed on at least a portion of a side surface of the via hole.

A laminate comprising a substrate; an adhesive layer formed on at least one surface of both surfaces of the substrate so as to be in direct contact with the substrate; and a plating layer formed on a surface of the adhesive layer opposite to the substrate, wherein the adhesive layer comprises a plating catalyst containing a precious metal, and a silane coupling agent.

Provided is a method for manufacturing a board with a roughened surface and a method for manufacturing a board having a plated layer that allow easily manufacturing the board having a plated layer. One of embodiments is a method for manufacturing a board with a surface roughened for wiring formation. The method for manufacturing a board includes performing laser ablation on a board containing a resin at least on a surface of the board. A laser light irradiated in the laser ablation is a laser light having a pulse width of 1 ps or less, a wavelength of 320 nm or more, and an output of 1 W or less.