The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.

A printed circuit board according to an embodiment includes: an insulating layer including a via hole; and a via disposed in the via hole of the insulating layer, wherein the via includes; a connection portion disposed in the via hole of the insulating layer; a first pad disposed on an upper surface of the insulating layer and an upper surface of the connection portion; and a second pad disposed under a lower surface of the insulating layer and a lower surface of the connection portion, wherein the upper surface of the connection portion has a concave shape in a downward direction, the lower surface of the connection portion has a concave shape in an upward direction, a lower surface of the first pad has a convex shape corresponding to the upper surface of the connection portion, and an upper surface of the second pad has a convex shape corresponding to the lower surface of the connection portion.

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer and including a signal wiring, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer has an opening such that the opening is exposing a portion of the first conductor layer and that the via conductor is formed in the opening of the resin insulating layer, and the resin insulating layer includes inorganic particles and resin such that the resin is forming the surface of the resin insulating layer.

A wiring board according to the present disclosure includes a core board including an upper surface, a lower surface, a through-hole penetrating from the upper surface to the lower surface, and a plurality of glass fibers located inside, and a through-hole conductor located in the through-hole. The through-hole conductor includes a first portion located on an inner wall of the through-hole, and second portions connected to the first portion and located inside the glass fibers. The second portions include portions in a first direction and a second direction intersecting the first direction in a planar direction of the core board, the portions having a shorter length in the planar direction from the inner wall of the through-hole than portions, of the second portions, in directions other than the first direction and the second direction.

A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.

A current introduction terminal includes a board made of resin. The board has a first face and a second face opposite each other. The board hermetically separates environments of different air pressures from each other. A plurality of through via holes corresponding both to a plurality of metal terminals of a first surface-mount connector to be mounted on the first face and to a plurality of metal terminals of a second surface-mount connector to be mounted on the second face are formed to penetrate between the first and second faces, and then hole parts of the through via holes are filled with resin.

A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having a 1.2 or more aspect ratio in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.

A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.