A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.

A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.

A multilayer circuit board including a ceramic substrate part and a unit circuit board coupled to one surface of the ceramic substrate part. The unit circuit board includes an insulating layer with a circuit pattern formed on one side, an adhesive layer adhered to another surface of the insulating layer, a via hole passing through the insulating layer and the adhesive layer and connected to one surface of the circuit pattern, and conductive paste filled in the via hole.

A manufacturing method including batch bonding a circuit board part, which includes a plurality of unit circuit boards, and a ceramic substrate part, wherein each unit circuit board includes providing an insulating layer having a circuit layer, forming an adhesive layer on the insulating layer, forming a circuit pattern, forming a via hole in the insulating and adhesive layers, and filling the via hole with conductive paste.

An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.

A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers.

A printed circuit board which improves the peel strength of a wiring pattern formed at a cavity bottom portion while enabling connection between an electronic component inside a cavity and a circuit outside the cavity to be performed at the cavity bottom portion, includes a cavity in a partial region of a multilayer substrate laminated with an insulating resin layer and an electrical conductor layer on a bottom layer of an insulating resin substrate. The cavity opens on a side of the insulating resin substrate, penetrates the insulating resin substrate, and includes a surface of the insulating resin layer as a bottom surface. The electrical conductor layer has a surface, the surface having a height equivalent to a height of the surface of the insulating resin layer and being embedded in the insulating resin layer in a manner to form a portion of the bottom surface.

A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.