A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

The invention discloses a circuit board enhancing structure and a manufacture method thereof. The method includes the following steps: providing a substrate; forming a first circuit on the substrate; forming a first dielectric layer enclosing the first circuit on the substrate; forming a first opening on the first dielectric layer; forming a first pattern photoresist layer on the first dielectric layer to divide a surface of the first dielectric layer as a first structure enhancing area and a second circuit area, wherein the first opening is disposed in the first structure enhancing area; forming a second circuit in the second circuit area and a first enhancing structure in the first opening, wherein the first enhancing structure protrudes from the first opening; removing the first pattern photoresist layer; and forming a second dielectric layer enclosing the second circuit and the first enhancing structure on the first dielectric layer.

A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.

A circuit board including an adhesive part, a ceramic board part with the adhesive part, and a printed circuit board part with the adhesive part. The ceramic board and printed circuit board parts are made of different materials. The adhesive part includes: an adhesive layer including an adhesive material, an adhesive part opening, and a conductive paste filled in an inside of the adhesive part opening.

A method including providing a ceramic board part, providing a printed circuit board part, and producing an adhesive part. Batch-bonding the printed circuit board part, the adhesive part, and the ceramic board part with one another. Producing the adhesive part includes: bonding a protection layer on two surfaces of an adhesive layer, forming an adhesive part opening penetrating the adhesive layer and the protection layer, filling the adhesive part opening with a conductive paste, and removing the protection layer.

A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.

A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

A method of producing a multilayer printed circuit board includes a metallic conductor structure including providing a base substrate including a film or plate and having first and second substrate sides, which base substrate at least partly consists of an electrically non-conductive organic polymer material and wherein the first substrate side is covered with a cover metal layer, partially removing the cover metal layer while subdividing the first substrate side into at least one first partial area, in which the first substrate side is free of the cover metal layer, and into at least one second partial area, in which the first substrate side is covered with the cover metal layer, and causing a plasma to act on the first substrate side with the aid of which plasma the polymer material is removed in the at least one first partial area while forming at least one trench.

A printed circuit board includes an insulating layer; a recess portion disposed on one surface of the insulating layer; and a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern. At least a portion of the ground pattern covers at least a portion of the recess portion.

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.