RF absorbing structures include a dielectric layer, such as polycarbonate, and one or more layers of a carbon resistive material, such as carbon ink. The RF absorbing structures can further include one or more layers of a conductive material, such as silver ink.

A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.

A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

To provide a wiring formation method that can increase the wiring density in a case where wiring is formed on an inclined surface by three-dimensional additive manufacturing. The wiring formation method of the present disclosure includes a metal member forming step of forming multiple metal members with a first fluid containing metal particles, a resin layer forming step of forming a resin layer including an upper surface and an inclined surface inclined downward from the upper surface, and a connection wiring forming step of forming multiple connection wirings on the inclined surface and the upper surface of the resin layer with a second fluid containing metal particles, and the connection wirings being formed to individually connect the multiple connection wirings to the multiple metal members on a lower surface of the inclined surface.

A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

A molding method includes a discharging step of discharging a resin material on a cured resin layer, a flattening step of transferring a part of the resin material discharged by the discharging step from the cured resin layer to a roller to flatten the resin material, and a curing step of irradiating the resin material flattened by the flattening step with light having a predetermined light amount to cure the resin material, and forming a new cured resin layer on the cured resin layer, in which the discharging step, the flattening step, and the curing step are repeatedly executed, and the cured resin layer is laminated, and the light amount is used in which a first contact angle of the resin material with respect to the cured resin layer is larger than a second contact angle of the resin material with respect to the roller.