A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (e.g., epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4). The jet printing unit can also be used for sintering and/or ablating materials. Printed materials are cured by heat or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.

A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

This invention discloses a simplified pen core module and the preparation method thereof. The pen core module is characterized in that it adopts PCB board as the main body of pen core, and the PCB board is covered with FPC boards that serve as pins; a hollow threaded seat is sleeved at the strip part of the PCB board, and is electrically connected with and fixed at the root step of the strip part; a hollow metal cylinder and a hollow cone part are sleeved in sequence at the relative position of the strip part of the PCB board and, through the hollow interior thereof, electrically connected with the bonding pad of the PCB board and fixed at the relative position; a heat resisting insulation ring is sleeved between every two of the threaded seat, metal cylinder and cone part.