A circuit board having a plurality of conductive layers including a first conductive layer and a second conductive layer is provided. The circuit board includes a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers. The plurality of non-conductive layers include at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer. At least one collapsed stud bump extends at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

A method for manufacturing a multilayer wiring substrate includes forming a resist layer having mask pattern, forming a conductor layer having conductor pattern using the resist layer, removing the resist layer, forming an insulating layer on the conductor layer such that the insulating layer is laminated on the conductor layer, forming a subsequent resist layer having mask pattern such that the subsequent resist layer is formed on the insulating layer, and forming a subsequent conductor layer having conductor pattern using the subsequent resist layer. The forming of the resist layer includes conducting first correction in which formation position of entire mask pattern of the resist layer is corrected with respect to reference position, and conducting second correction in which shape of the mask pattern of the resist layer is corrected with respect to reference shape, and the forming of the subsequent resist layer does not include conducting the second correction.

A circuit board includes a first layer, a second layer, a third layer, a plurality of plating through holes, at least one first intermediate layer and at least one second intermediate layer. The first layer and the second layer are used as reference voltage planes. A plurality of transmission wires are disposed on the third layer. The transmission wires are coupled to a wireless signal transceiver and a plurality of antenna arrays; wherein the third layer is disposed between the first layer and the second layer. The plating through holes are disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane. The first intermediate layer is disposed between the first layer and the third layer, and the second intermediate layer is disposed between the second layer and the third layer.

A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.

An electronic-component carrier board includes carrier plates formed in a stack, and insulating layers each disposed between two adjacent ones of the carrier plates. Multiple conductive pins extend through the insulating layers and the carrier plates. Multiple conductive wires equal in length and width are provided. Each conductive wire is connected to one of the conductive pins, covered by one of the insulating layers, disposed between two adjacent ones of the carrier plates, and extends outwardly from the stack of the carrier plates. A wiring method for the electronic-component carrier board is also disclosed.

A method of producing a multilayer printed circuit board includes a metallic conductor structure including providing a base substrate including a film or plate and having first and second substrate sides, which base substrate at least partly consists of an electrically non-conductive organic polymer material and wherein the first substrate side is covered with a cover metal layer, partially removing the cover metal layer while subdividing the first substrate side into at least one first partial area, in which the first substrate side is free of the cover metal layer, and into at least one second partial area, in which the first substrate side is covered with the cover metal layer, and causing a plasma to act on the first substrate side with the aid of which plasma the polymer material is removed in the at least one first partial area while forming at least one trench.

[Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure.

[Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure. In addition, the upper surface side interlayer circuit 12 and the lower surface side interlayer circuit 13 can be disposed at misaligned positions in the plane direction of the printed circuit board, and thus the degree of freedom in circuit design increases. Plane circuits 24 and 16 not connected to the first circuit can be disposed with insulating layers 31 and 32 sandwiched below the upper surface side interlayer circuit 12 or above the lower surface side interlayer circuit 13.