To provide an electric component socket in which a pressing surface of a pressing member is prevented from contacting a contact pin when the socket is pressed by the pressing surface in a state where a first electric component is not housed in the socket. A pressing surface of a pressing mechanism contacts a first electric component when the pressing mechanism is moved downward in a state where the first electric component is housed in a plate. On the other hand, when the pressing mechanism is moved downward in a state where the first electric component is not housed in the plate, a push-up member is lifted up with the plate to push up the pressing surface. Therefore, the pressing surface is moved upward to prevent the pressing surface from contacting the contact pin.

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

An opening/closing mechanism of a cover member that can easily push down the cover member by the lever member even if the force from the base member side to the cover member is increased, improving the operability of the lever member. A solution is that the lever member 17 is rotatably supported to the base member 23 by the first shaft 31, the link plate 29 is mounted to the lever member 17 by the second shaft 32, the cover member 15 is mounted to the link plate 29 by the third shaft 33, and the link plate 29 is rotated around the axis of the first shaft 31 in the direction in which the lever member 17 closes, so that the link plate 29 moves through the second shaft 32, and the link plate 29 moves, so that the cover member 15 is depressed through the third shaft 33.

An electrical connector assembly includes an electrical connector and a CPU. The electrical connector includes an insulative housing defining a receiving cavity, and a plurality of contacts retained to the housing with corresponding contacting sections exposed in the receiving cavity. A first securing piece is attached upon the CPU, and a second securing piece is attached upon the housing. When the CPU is received within the receiving cavity, the first securing piece is locked with the second securing piece so as to have the CPU retained to the connector in position wherein the corresponding contacts of the electrical connector are mechanically and electrically connected to the corresponding contacting pads of the CPU in a compression manner reliably.

An electrical connector includes: a base and a contact module received by the base; a cover movably disposed relative to the base; and a latch mechanism including a pair of latches pivotably disposed relative to the cover and rotatably disposed relative to the base, wherein each of the pair of latches has an upper guiding portion and the base has a corresponding portion for engaging the upper guiding portion.

A burn-in board for testing the operational integrity of memory devices includes local heating elements for each memory device under test. Each socket on the burn-in board may include a pair of opposed latch heads which move between open positions allowing a memory device to be mounted in the socket, and closed positions where the latch heads rest against the memory device to secure the device in the socket. Local heating elements may be integrated into the latch heads to ensure even heating of each memory device in the burn-in board.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

Disclosed is a socket apparatus for gripping the balls of a ball grid array (BGA), including a base member of electrically insulative material, an array of pairs of electrical contacts disposed in the base member in a configuration corresponding to a terminal ball configuration of said BGA to be mated with the socket apparatus, a first plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, a second plate member disposed for slidable movement on said base member and having a plurality of parallel extension members extending therefrom and configured to pass through the array of pairs of electrical contacts, the plurality of parallel extension members of said first plate member disposed between the plurality of parallel extension members of said second plate member, a plurality of insulative nodules disposed on each extension member with nodules forming an array corresponding to said array of pairs of electrical contacts, and the first plate member and second plate member being movable relative to each other on said base member whereby the plurality of insulative nodules urge the corresponding electrical contacts into electrical contact engagement with the balls of a BGA in the socket.

To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.