An information handling system may include an information handling resource, at least one fluidic conduit thermally coupled to the information handling resource and configured to convey a cooling liquid proximate to the information handling resource in order to cool the information handling resource, an air mover support infrastructure comprising a plurality of bays, each bay of the plurality of bays configured to receive an air mover for cooling components of the information handling system, and a liquid manifold sized and shaped to be received in at least one of the plurality of bays and received in a first bay of the plurality of bays and configured to enable at least one fluidic conduit to fluidically couple to an external cooling system, wherein the external cooling system is configured to deliver cooled cooling liquid to the information handling system, receive warmed cooling liquid from the information handling system, and cool the warmed cooling liquid.

A computer device and a host module thereof are provided. The host module includes a case, a motherboard, and a power supply unit. The case includes a first side plate, a second side plate, a front panel, a rear panel, and a separation structure. The rear panel is located on an opposite side of the front panel. The first side plate, the second side plate, the front panel, and the rear panel enclose an internal space. The separation structure is located in the internal space, extends from the first side plate to the second side plate, and divides the internal space into a first part and a second part. The second part is located under the first part. The motherboard is disposed in the first part. The power supply unit is disposed in the second part, and is electrically connected to the motherboard.

A two-phase immersion cooling device includes a box body, a plurality of heating elements, a condenser, a cover body, and at least one fan. The box body includes a plurality of side walls and a bottom wall, the side walls are connected to each other top to bottom, the bottom wall is connected to one end of the side walls, the side walls and the bottom wall jointly form an accommodating cavity, and the accommodating cavity contains coolant. The condenser is received in the accommodating cavity, and is arranged along sidewalls of the tank. An upper cavity surrounded by the condenser is defined. The cover body covers the box body to seal the accommodating cavity, the cover body expands on the box body to expose the accommodating cavity to outside. At least one fan is fixedly disposed on the cover body and is accommodated in the upper cavity.

An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

Examples described herein relate to an interface and a network interface device coupled to the interface and comprising circuitry to: control power utilization by a first set of one or more devices based on power available to a system that includes the first set of one or more devices, wherein the system is communicatively coupled to the network interface and control cooling applied to the first set of one or more devices.

A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.

The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

According to various embodiments of the disclosure, an electronic device may includes: a first housing in which a display module is disposed; a second housing in which a circuit board and a cooling fan connected to the circuit board are accommodated, where a first opening is defined in the second housing to introduce air into the cooling fan; and a hinge module rotatably connected to the first housing and the second housing, and disposed adjacent to the first opening. The hinge module may includes: a hinge housing in which a first hinge opening is defined to be connected to the first opening; a first main gear disposed in the hinge housing and operably connected to the first housing; a second main gear operably connected to the second housing and configured to rotate in correspondence with the first main gear; a driving gear disposed adjacent to at least one of the first main gear or the second main gear and rotatable in correspondence with at least one of the first main gear or the second main gear; and a first cover plate disposed in the hinge housing and including a first rack gear area which meshes with the driving gear. The electronic device may be switchable between a closed state in which an angle formed by the first housing and the second housing is less than a predetermined angle and an open state in which the angle formed by the first housing and the second housing is equal to or greater than the predetermined angle. When the electronic device is in the closed state, the first cover plate is disposed to overlap with at least part of the first hinge opening. When the electronic device is in the open state, the first cover plate may be spaced apart from the first hinge opening, and the first hinge opening may be opened.