Patent classifications
H05K7/202
COORDINATED CONTROL OF MULTIPLE COMPONENTS FOR CLOSED-LOOP ENCLOSURE COOLING
One example implementation provides a method for controlling enclosure interior temperature, including obtaining, from a thermostat, temperature data indicative of interior enclosure temperature; determining, using a controller, that the temperature data indicates that the interior enclosure temperature exceeds a set point; simulating for a heat exchanger, using the controller, loss of alternating current (AC) power supply; and thereafter operating, using the controller, the heat exchanger and an air conditioner above the set point.
Electronic display with cooling
A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.
SIDE-COOLED MODULAR DATA CENTER
A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.
Temperature management system for autonomous vehicles
Techniques are described for managing temperature in an autonomous vehicle. An exemplary method comprises performing autonomous driving operations that operate the autonomous vehicle in an autonomous mode, receiving one or more messages from a temperature sensor associated with an electrical device located on or in the autonomous vehicle while the autonomous vehicle is operated in the autonomous mode, determining a cooling technique to reduce the temperature of electrical device, and performing the cooling technique.
Power Converter
A power converter includes: a first circuit board; a cooling body; a housing, wherein the cooling body and the housing surround the first circuit board; a heat-generating component which is arranged on a side of the first circuit board facing the cooling body and which is coupled to the cooling body in a heat-conducting manner; and further components. The cooling body, the housing and the first circuit board border a first volume, in which the heat-generating component is arranged. The cooling body, the housing and the first circuit board border a second volume, in which the further components are arranged.
CORONA DISCHARGE POWERED COOLING
A thermal management system includes an ionic motion generator to direct fluid flow towards a heated component (e.g., equipment to be cooled or a heatsink mounted thereat). In certain systems, the fluid is directed through a conduit arrangement. In certain systems, the fluid is directed past the heated component to a heat exchanger. Certain types of thermal management systems have no moving components to create the fluid flow.
SYSTEM AND METHOD FOR COOLING A COMPUTING DEVICE
A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.
HEAT EXCHANGER, ELECTRIC CONTROL BOX AND AIR CONDITIONING SYSTEM
A heat exchanger includes: a heat exchanger body, the heat exchanger body being provided with first micro-channels and second micro-channels; and a header assembly, including a first header and a second header. The first header is provided with a first header channel which is used for providing a first refrigerant flow to the first micro-channels and/or collecting a first refrigerant flow flowing through the first micro-channels, and the second header is provided with a second header channel which is used for providing a second refrigerant flow to the second micro-channels and/or collecting a second refrigerant flow flowing through the second micro-channels, and heat is exchanged between the first refrigerant flow flowing through the first micro-channels and the second refrigerant flow flowing through the second micro-channels.
HYBRID MOTHERBOARD COOLING SYSTEM FOR AIR-COOLED SERVERS
A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.
LIDAR system including convection cooling
A LIDAR system that includes a laser unit, a receiving unit, and a cooling device for generating a cooling airflow. The laser unit, the receiving unit, and the cooling device are situated rotatingly about a rotational axis, so that the cooling airflow for cooling the rotating components is generated by the LIDAR system itself.