An immersion cooling assembly comprises at least one primary heat-generating electronic component and a flow-through cooling module mounted near the at least one primary heat-generating component. The flow-through cooling module comprises at least one inlet conduit to accept an inflow of pressurized dielectric coolant, a fluid chamber through which fluid flows to provide targeted, direct cooling to a heat-generating component, and exit passageways to facilitate flow-through of the dielectric coolant into a surrounding immersion bath for cooling of other components. As it flows out of the cooling module and over the heat-generating component, the coolant fluid absorbs heat from the heat-generating electronic component. In certain embodiments, the assembly may also comprise at least one periphery heat-generating electronic component, which may also be cooled by the dielectric coolant as it exits the vicinity of the flow-through cooling module. The cooling module may include impingement nozzles to accelerate and direct the flow of coolant fluid toward the high-heat-generating electronic component.

A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.

A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component. The nozzle allows liquid coolant to pass the first heat-generating component at a faster rate than the second heat-generating component.

A system and a method are disclosed for a cooling bath designed to provide a sufficient and evenly distributed coolant flow throughout the bath. The cooling system includes a holding unit with a coolant distribution chamber that will distribute coolant through multiple distribution pipes beneath device chambers, promoting even distribution of coolant through the device chambers. An external pump causes coolant to be expelled from the cooling bath. The flow of coolant expelled from the cooling bath is controlled in a coolant separation chamber with a separation layer that bisects the coolant separation chamber. The separation layer is perforated with calibrated holes to slow down the speed of coolant exiting the cooling bath to prevent a funnel effect, protect the device chambers from coolant waves and coolant level fluctuation generated by the pump, and evenly distribute removal of hot coolant from the cooling bath.

A fixing device includes a main body, a sliding block, and a fixing rod. The main body has a sliding rail and a guiding hole, and the sliding rail which is disposed at a front side of the main body vertically extends. The guiding hole adjoins the sliding rail and horizontally extends through the main body. The sliding block is slidably connected to the sliding rail. The fixing rod is movably connected to the sliding block extending through the guiding hole, and the sliding block is configured to move along the sliding rail and enable the guiding hole to drive the fixing rod to horizontally move.

An immersion tank is used for cooling an electronic circuit. The immersion tank includes a tank body that stores coolant, a housing that is provided inside the tank body and that houses the electronic circuit, a moving member movably supported relative to the tank body, a supply hole which is formed in the housing and through which the coolant is supplied to an inside of the housing, an opening/closing member that is displaced from a closed position at which the opening/closing member closes the supply hole to an open position at which the opening/closing member opens the supply hole, and an operatively associated mechanism that displaces the opening/closing member in accordance with movement of the moving member.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

An immersion cooling system miniaturized by the omission of a pump and heat exchanger includes a first casing for containing a non-conductive coolant in which a heat-generating component is immersed, fins disposed on and located outside the first casing, and a second casing. The first casing is disposed in the second casing, and the second casing defines a first vent hole exposing the fins. The immersion cooling system dissipates heat by means of natural convection.

A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.