A pumpless liquid-cooling heat dissipator includes a cooling head assembly and a condensing assembly. The cooling head assembly and the condensing assembly are connected through the connecting assembly to form a loop. The cooling head assembly and the condensing assembly both are filled with a liquid refrigerant. The use of refrigerant as a cooling medium is more effective compared with the water cooling, has better overall heat dissipation, and can overcome disadvantages of complex wiring of the water-cooling heat dissipator and poor heat dissipation of the heat pipe, and thus can quickly cool down the temperature of component. Compared with the existing water-cooling heat dissipator, the structure is simpler, the circulating cooling can be realized without mechanical drive e.g., water pump, and there is no extension of excess water pipe, which is more convenient for installation and makes the computer case cleaner.

A heat exchanger includes: a heat exchanger body, the heat exchanger body being provided with first micro-channels and second micro-channels; and a header assembly, including a first header and a second header. The first header is provided with a first header channel which is used for providing a first refrigerant flow to the first micro-channels and/or collecting a first refrigerant flow flowing through the first micro-channels, and the second header is provided with a second header channel which is used for providing a second refrigerant flow to the second micro-channels and/or collecting a second refrigerant flow flowing through the second micro-channels, and heat is exchanged between the first refrigerant flow flowing through the first micro-channels and the second refrigerant flow flowing through the second micro-channels.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

The invention provides a two-phase flow active and passive multi-level data center cabinet cooling device and method, wherein the system includes a cabinet cooling device, a condensate system, a waste heat recovery device, a liquid reservoir, a liquid pump, a gas chamber, a fluid working medium, and a corresponding pipeline. The system constitute a closed loop, the loop is filled with nitrogen to maintain a low pressure state, and the pipeline fluid is driven by the liquid pump to flow; the gas chamber maintains a relatively stable air pressure in the two-phase flow loop; the liquid reservoir is connected with the gas chamber, providing an enough gas space to make a phase change occur more easily; the cabinet cooling device can be switched between an active mode and a passive mode to minimize PUE under good heat dissipation capability.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.

In some examples, a system uses ambient air from outside a controlled airflow environment to cool equipment within the controlled airflow environment. The system can include ductwork that seals the ambient air from air outside of the ductwork within the controlled airflow environment. The system can further include a passive heat exchanger connected to the equipment and extending into an interior of the ductwork to allow heat exchange between the equipment and the ambient air. The system can further include a fan to flow the ambient air through the ductwork, the fan being connectable to the equipment to allow the equipment to control the operation of the fan.

A subsea unit includes a housing containing a dielectric liquid, a first heat generating component and a second heat generating component. The first heat generating component is arranged in thermal connection with the housing and the second heat generating component is arranged at a distance from the housing. A method of cooling heat generating components contained in a housing of a subsea unit is also presented.

A method and electrical connection for providing electrical power is disclosed. The electrical connection comprises an electrical connector connected to an electrical conductor assembly. A current greater than a rated current capacity of at least one of the electrical connector and electrical conductor assembly may be passed through the electrical conductor assembly and electrical connector. The electrical connector and electrical conductor may be actively cooled with a flow of heat transfer medium flowing substantially along a length of the electrical conductor assembly and through the electrical connector to increase the current capacity of the electrical connection.