A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

A heat-transfer system includes a cooling circuit configured to convey heated coolant from one or more cooling nodes to one or more heat-rejection devices, and to convey the cooled coolant from the one or more heat-rejection devices to the one or more cooling nodes. Each cooling node facilitates a transfer of heat to the coolant, the heat being from one or more heat-dissipation devices and a corresponding heat load on the respective cooling node. Each heat-rejection device facilitates heat transfer from the coolant to another medium. The heat-transfer system also has a selectively operable flow-control device configured to control a flow rate of the coolant through a segment of the coolant circuit. A control logic selectively operates the flow-control device responsive to an output from one or more sensors to tailor a cooling capacity available to each cooling node to the real-time heat load on the respective cooling node.

A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Methods and apparatus for an autonomous stage-switching multi-stage cooling device are disclosed are disclosed. A disclosed example coolant distribution unit (CDU) includes an enclosure, an inlet and an outlet of the CDU to be fluidly coupled to a cooling block associated with a heat generating source, at least one sensor to measure a first temperature corresponding to the inlet and a second temperature corresponding to the outlet, and a plurality of valves to be controlled by a controller to control a flow of fluid from the inlet to at least one of an ambient cooler or a sub-ambient cooler based on: (i) a comparison of the first temperature to an ambient temperature and (ii) a comparison of the second temperature to a target temperature.

Provided is an electronic apparatus, including a heat generating element, a heat dissipation module, and a control unit. The heat dissipation module is adapted for performing heat dissipation on the heat generating element. The control unit is coupled to the heat dissipation module and is adapted for measuring temperature variation of at least one temperature module and state variation of at least one system component and for adjusting the heat dissipation module via a control signal based on the state variation and the temperature variation. In addition, a dynamic heat dissipation control method and a dynamic heat dissipation control system are also provided.

The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.

A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is disposed in the cavity and is configured to deform based on a temperature of the cooling liquid in the cavity, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

A container data center is provided. The data center is provided in a shipping container, and the container data center includes a cooling system including a plurality of cooling devices for cooling the data center; a power supply and distribution system including a power supply circuit for supplying power to the data center; and a control system electrically connected to the cooling system and the power supply and distribution system; wherein the control system comprises a plurality of control devices, the plurality of control devices each configured to control a part of the cooling devices, and when a first part of the plurality of control devices cannot work, a working mode of a second part of the control devices is adjusted to control the plurality of the cooling devices.