A two-phase immersion cooling device includes a box body, a plurality of heating elements, a condenser, a cover body, and at least one fan. The box body includes a plurality of side walls and a bottom wall, the side walls are connected to each other top to bottom, the bottom wall is connected to one end of the side walls, the side walls and the bottom wall jointly form an accommodating cavity, and the accommodating cavity contains coolant. The condenser is received in the accommodating cavity, and is arranged along sidewalls of the tank. An upper cavity surrounded by the condenser is defined. The cover body covers the box body to seal the accommodating cavity, the cover body expands on the box body to expose the accommodating cavity to outside. At least one fan is fixedly disposed on the cover body and is accommodated in the upper cavity.

According to one embodiment, a server chassis for immersion cooling includes a chassis frame having a chassis base and an adjustable server panel coupled to the chassis base to receive a server blade to be mounted on the adjustable server panel. The server blade includes a first portion and a second portion. The first portion has a first set of electronic components and the second portion has a second set of electronic components. The adjustable server panel is adjustably mounted along the chassis base, such that when the server chassis is deposited into a container having two-phase coolant therein, the first set of electronic components is at least partially submerged into a liquid region filled with the two-phase coolant, and the second set of electronic components is positioned within a vapor region above an immersion line defining the liquid region and the vapor region.

A tank assembly has heat-generating equipment contained therein. The tank assembly includes a tank having an opening, and a thermal siphon fixed to the tank and sealing the opening of the tank. The thermal siphon has a main body portion and a loop portion. The thermal siphon contains a liquid and a gas. A center of the loop portion is exposed to the environment.

A two-phase immersion cooling device includes an upper box body, a lower box body, a plurality of heating elements, and a condenser. The walls of the upper box body form a first cavity. The lower box body defines a second cavity containing coolant. The heating elements are disposed in the second cavity and immersing in the coolant. The condenser in the upper box body includes multiple rows and columns of condensing tubes, is arranged across or along the upper box body to fill the first cavity. The lower box body is detachably and hermetically connected to the bottom of the upper box body, connecting the second cavity with the first cavity to form an accommodating cavity.

A battery chassis for immersion cooling includes one or more groups of battery cells, an inlet, a condenser, and one or more fluid connectors disposed on the top of the chassis. For example, an inlet is disposed on a bottom of the chassis to receive two-phase cooling fluid from an immersion container, and the two-phase cooling fluid is to extract heat from the one or more battery cells and to transform from a liquid form into a vapor. A condenser is disposed on a top of the chassis to condense the vapor contained within the chassis of the two-phase fluid back into the liquid form. One or more fluid connectors disposed on the top of the chassis to connect the condenser with external cooling fluid via a liquid line, and the battery chassis is to be at least partially submerged in the two-phase cooling fluid of the immersion container.

An immersion-type heat dissipation structure and a method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that has a plurality of heat dissipation columns and is disposed on the first heat dissipation member. The second heat dissipation member has a porous structure, the first heat dissipation member has a solid structure, and a thermal conductivity of the first heat dissipation member is greater than that of the second heat dissipation member. A shortest distance between two bottoms of any two adjacent ones of the heat dissipation columns is between 0.2 mm and 1.2 mm, a minimum diameter of a top surface of the heat dissipation column is between 0.2 mm and 1.2 mm, and a draft angle formed on a side surface of the heat dissipation column is between 1° and 5°.

An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.