A cooling system for data centre, which data centre includes a plurality of servers associated to form a rack, each server being provided with one or more heat generating means. The system includes a plurality of first heat exchange circuits and second thermosyphon circuits. The overall configuration of the system being such that the second thermosyphon circuits are in fluid communication with each other according to a parallel connection.

Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

A thermal conductive device and thermal conductive device manufacturing method, an electrical connector, and an electronic device. The thermal conductive device comprises first housing, a second housing, a capillary mesh component, and a coolant. The second housing is disposed on the first housing. An airtight and vacuumed accommodating space is provided between the first housing and the second housing. The capillary mesh component is disposed in the accommodating space. The capillary mesh component comprises a plurality of capillary pores. The plurality of capillary pores and the accommodating space form a plurality of interconnected circulation channels. The coolant is filled in the accommodating space. Inside the thermal conductive device, the conventional copper powder sintered configuration is replaced with capillary mesh component, so that the thermal conductive device could be thinned and could present a better thermal conductivity.

A cooling system includes an evaporator associated with a heat source. A condenser is located at a higher elevation than the evaporator. A heat pipe structure fluidly connects the evaporator with the condenser. A fan forces air through the condenser. A working fluid is in the evaporator so as to be heated to a vapor state, with the heat pipe structure transferring the vapor to the condenser and passively returning condensed working fluid back to the evaporator for cooling of the heat source. A plurality of thermoelectric generators is associated with the condenser and converts heat, obtained from the working fluid in the vapor state, to electrical energy to power the fan absent an external power source. The thermoelectric generators provide the electrical energy to the fan so that a rotational speed of the fan is automatically self-regulating to either increase or decrease based on a varying heat load.

A photovoltaic junction box comprising a diode module and a circuit board disposed in a box body, and a heat sink mounted on the outer surface of the box body. The diode module is attached to the back side of the heat sink and is electrically connected to cooper conductor. The heat sink is made of aluminum material and a heat-absorbing layer is provided inside the heat sink. The heat-absorbing layer is close to the diode module. The aluminum heat sink provides great thermal conductivity, therefore, can greatly increase the cooling capacity of the junction box. In addition, because metal material for higher temperature resistance is used instead of lower temperature resistance plastic material, the box body would not deform as easy, greatly increase the safety and reliability of the junction box.

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

A power conductor for conducting electricity between a power source and a load is disclosed. A conductive body connects between the power source and the load. A sealed chamber is provided in the interior of the conductive body and contains a working fluid for changing phase when heated. A circuit, a vehicle power distribution circuit, and a vehicle incorporating the same are also disclosed.

An outdoor-mountable, telecommunications module, comprising: an environmentally hardened housing; telecommunications equipment encased within the housing and disposed for rotation about an axis within the housing; and a thermal load mitigation system employing (i) a heat spreader structure for thermal conduction of heat away from at least some heat-generating components of the telecommunications equipment, to a rotatable heat sink structure received within the housing, (ii) an arrangement for primarily thermal conduction of heat across a small air gap between the rotatable heatsink structure and a non-rotating heat sink structure collocated within the housing, and (iii) an arrangement for convective heat dissipation into the environment from a radiator structure disposed outside of the housing and which is in direct thermal conductive arrangement with the non-rotating heat sink structure disposed inside of the housing.