Internal interchangeable modular avionics platform assemblies and methods for removably mounting and interchanging modular avionics platforms within an aircraft. In some embodiments, modular avionics platform assemblies may include a modular avionics platform configured to support various avionics equipment, suitable for removable mounting within a forward fuselage, and interchangeable with a number of alternate platforms. A platform may include a frame structure, and mounting pins and a connector assembly disposed on the frame structure. The mounting pins may project outwardly from the frame structure to align with and detachably secure to corresponding airframe members of an aircraft when the frame structure is in a mounted position. The connector assembly may be disposed on the frame structure and have a plurality of connectors, including connectors for alternating current, direct current, and data. In some embodiments, the platform may also include an environmental cooling system disposed on the frame structure.

A distributed composite refrigeration system includes a multichannel heat exchanger and at least two refrigeration units. The at least two refrigeration units are connected to at least two indoor areas in one-to-one correspondences. Each refrigeration unit includes a refrigeration part, a heat exchange part, and a heat dissipation part. A refrigerant flows between the refrigeration part and the heat exchange part, an intermediate medium flows in the heat exchange part, and the refrigerant and the intermediate medium implement heat exchange at the heat exchange part. The heat exchange part delivers the intermediate medium obtained after heat exchange to the heat dissipation part and/or the multichannel heat exchanger for heat dissipation. The multichannel heat exchanger is thermally connected to an external pipe network, and the intermediate medium performs heat exchange with a heat carrying body in the external pipe network.

A composite refrigeration system includes a refrigeration part, a heat dissipation part, a first pipeline, a second pipeline, and a refrigerant. The refrigeration part uses the refrigerant to cool air sent into indoor space, and the heat dissipation part is configured to perform heat dissipation on the refrigerant. In addition, in two heat dissipation modes, the heat exchanger may exchange heat between the refrigerant and a heat carrier in an external pipeline network to implement heat dissipation. The composite refrigeration system implements, by using the heat exchanger, a function of exchanging heat with the external pipeline network, so that heat generated during operation of the composite refrigeration system can be at least partially transferred to the heat carrier in the external pipeline network, to implement the energy recycle and reuse.

A refrigeration system for a data center includes an indoor module, a main outdoor heat-dissipation module and an auxiliary outdoor heat-dissipation module, inlets of the first compressor and the second compressor are respectively connected to an outlet of the indoor module, outlets of the first compressor and the second compressor are respectively connected to a gaseous refrigerant inlet of the first condenser, liquid refrigerant outlets of the first condenser and the second condenser are respectively connected to an inlet of the indoor module, in which a refrigeration cycle passage for the data center is formed by the indoor module, the first condenser and the first compressor when the main outdoor heat-dissipation module is in a normal condition, and the refrigeration cycle passage for the data center is formed by the indoor module, the second condenser and the second compressor when the main outdoor heat-dissipation module fails.

An electronics cabinet cooling system may include multiple cabinet heat exchangers mounted at an air discharge of respective different electronic cabinets. Heat from a flow of air heated by electronic components in the electronic cabinets may be received by respective cabinet heat exchangers. A liquid refrigerant flowing through the heat exchangers in parallel may be at least partially changed from liquid to gas and absorb the heat from the flow of air. A three-way tee in a common outlet header downstream from the cabinet heat exchangers may direct the gas refrigerant to a condenser and the liquid refrigerant to a receiver. The condenser may condense the gas refrigerant to liquid refrigerant, which may be routed to the receiver.

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.

A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.