A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.

A cooling apparatus includes a housing, a cooling air duct, and an adsorption refrigeration unit. The housing includes a plurality of sidewalls, and the plurality of sidewalls form an inner cavity. The cooling air duct passes through the inner cavity. The adsorption refrigeration unit includes an adsorption bed, a flash evaporator, and an air cooler, the flash evaporator is connected to the air cooler, both the flash evaporator and the air cooler are disposed in the inner cavity, and the air cooler is located on a path of the cooling air duct. At least one of the plurality of sidewalls is a refrigeration sidewall, the refrigeration sidewall includes an internal wall plate and an external wall plate, the internal wall plate and the external wall plate are spaced apart and form sealed space, the sealed space is connected to the flash evaporator.

A refrigeration system and refrigeration method for a data center are disclosed. The refrigeration system includes: a first heat exchanger disposed on a back plate of an indoor cabinet of the data center, and a phase-change heat-exchange cooling tower disposed outdoor of the data center. The first heat exchanger and the phase-change heat-exchange cooling tower are communicated by a secondary refrigerant delivery pipeline. The phase-change heat-exchange cooling tower transfers heat carried in the secondary refrigerant into air and condenses the secondary refrigerant to a liquid again; the secondary refrigerant employs a phase-change heat-exchange working medium. An air pump is disposed in the phase-change heat-exchange cooling tower and on a by-pass of the secondary refrigerant delivery pipeline to pressurize the secondary refrigerant in gas-state delivered in the secondary refrigerant delivery pipeline to increase the condensing pressure for condensing the secondary refrigerant to a liquid again.

The invention relates to an apparatus (1) comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4). The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).

A thermal management system includes a housing having an interior space; a heat-generating component disposed within the interior space; and a working fluid disposed within the interior space such that the heat-generating component contacts a liquid phase of the working fluid; and an adsorber assembly disposed within the interior space. The adsorber assembly is in fluid communication with the interior space and an environment external to the thermal management system. The adsorber assembly is configured to: (i) receive a fluid stream from the interior space, the fluid stream including a vapor phase of the working fluid and a non-condensable gas; (ii) at least partially separate the working fluid from the fluid stream and, then, vent the fluid stream to the environment external to the fluid space; and (iii) return the separated working fluid to the interior space.

A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.

A heat transfer medium is used for a heat transfer system including a refrigerant cycle device through which a refrigerant circulates and a heat transfer medium circuit having an electric device. The medium includes an anhydrous liquid that does not contain water and is made of a substance having a polarity less than water. The anhydrous liquid is cooled by heat exchange with the refrigerant and absorbs heat from the electric device while circulating through the heat transfer medium circuit. Accordingly, the low viscosity of the heat transfer medium at a low temperature can be secured. Further, by using an anhydrous liquid without water as the heat transfer medium, it is possible to suppress an increase in an electrical conductivity of the heat transfer medium over time.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.

A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.