A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.

A dilution refrigerator is provided. The dilution refrigerator includes a plurality of thermalization plates configured to be cooled to a plurality of temperatures, and a first thermalization plate of the plurality of thermalization plates includes an integrated heat exchanger. The integrated heat exchanger includes channels formed in the first thermalization plate, and the channels are configured to allow helium to flow through the first thermalization plate during operation of the dilution refrigerator to improve heat exchange and cooling power of the dilution refrigerator.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A data center includes a refrigerant induction pipe surrounding one or more regions of the data center, a refrigerant supply device suitable for supplying a refrigerant to the refrigerant induction pipe, the refrigerant having a vaporization temperature corresponding to a pseudo cryogenic temperature, a plurality of racks disposed in the one or more regions, and a plurality of rotating devices, each rotating device being suitable for rotating a corresponding one of the plurality of racks.

An embodiment of a qubit tuning device includes a first layer configured to generate a magnetic field, the first layer comprising a material exhibiting superconductivity in a cryogenic temperature range. In an embodiment, the qubit tuning device includes a qubit of a quantum processor chip, wherein the first layer is configured to magnetically interact with the qubit such that a first magnetic flux of the first layer causes a first change in a first resonance frequency of the qubit by a first frequency shift value.

A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.

The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and/or operation of quantum information processing (QIP) systems, and more particularly, to the implementation and operation of a non-contact displacement measurement technique for cryogenic stabilization in QIP systems.

A method, apparatus, and system include a cooling system comprising a payload refrigeration unit, control refrigeration unit, and a signal interface. The payload refrigeration unit has a set of payload cooling components that operate to cool a payload. The control refrigeration unit has a set of control circuit cooling components in a control circuit. The signal interface connecting the payload is located in the payload refrigeration unit in the control circuit located in the control refrigeration unit.