An information handling system may include an information handling resource, at least one fluidic conduit thermally coupled to the information handling resource and configured to convey a cooling liquid proximate to the information handling resource in order to cool the information handling resource, an air mover support infrastructure comprising a plurality of bays, each bay of the plurality of bays configured to receive an air mover for cooling components of the information handling system, and a liquid manifold sized and shaped to be received in at least one of the plurality of bays and received in a first bay of the plurality of bays and configured to enable at least one fluidic conduit to fluidically couple to an external cooling system, wherein the external cooling system is configured to deliver cooled cooling liquid to the information handling system, receive warmed cooling liquid from the information handling system, and cool the warmed cooling liquid.

Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Rack mounting adapters with airflow management are disclosed. In one embodiment, rack mounting adapter apparatus comprises: a housing configured to adapt an electrical component chassis subrack configured for side-to-side airflow cooling to mount to an equipment rack; and an airflow management system within the housing that converts the side-to-side airflow cooling of the electrical component chassis subrack to a front-to-back airflow configuration that intakes air from a front of the equipment rack and exhausts air to a back of the equipment rack.

A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

An airflow device includes a cooling air passage structure formed external to and along a side of a server chassis, the cooling air passage structure extending in a depth direction of the server chassis from a front side of the server chassis. The airflow device further includes an airflow channel formed within the cooling air passage structure, the airflow channel extending in the depth direction, and a vent fluidically connecting the airflow channel with an interior of the server chassis at a vent location that is rearward in the depth direction relative to the front side.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

Examples described herein relate to an interface and a network interface device coupled to the interface and comprising circuitry to: control power utilization by a first set of one or more devices based on power available to a system that includes the first set of one or more devices, wherein the system is communicatively coupled to the network interface and control cooling applied to the first set of one or more devices.

The present disclosure provides a fan module and a case including the fan module. The fan module includes a fan, a fan bracket and a traction structure. The fan bracket includes: a fixed bottom plate for carrying and fixing the fan; and a connection structure, connected to the fixed bottom plate and used for being connected to a case through plugging. The traction structure is mounted on the fan bracket, and is used for pulling the fan bracket from the inside of the case to the outside of the case. In the present disclosure, the fan module is plugged into the case, and is pulled to the outside of the case from the inside of the case through a traction interface. In this way, the fan maintenance is implemented without disassembling the case or cutting off the power, the maintenance efficiency is improved, and the maintenance cost is reduced.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.

A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.