Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

An airflow device includes a cooling air passage structure formed external to and along a side of a server chassis, the cooling air passage structure extending in a depth direction of the server chassis from a front side of the server chassis. The airflow device further includes an airflow channel formed within the cooling air passage structure, the airflow channel extending in the depth direction, and a vent fluidically connecting the airflow channel with an interior of the server chassis at a vent location that is rearward in the depth direction relative to the front side.

A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.

A system and method for energy harvesting in a data center has one or more collection devices, a thermoelectric device, and a controller for directing the operation of the thermoelectric device and other equipment in the data center. The waste heat generated by the servers in the data center is harnessed and directed into the thermoelectric device where the waste heat is converted to usable electrical energy under the direction of the controller. The recycled electrical energy is then combined with utility-input power and provided to the servers and other equipment in the data center for consumption.

The present invention includes a cartridge and system utilizing the cartridge that cools a computer. The cartridge first within a server stand and urges forced fluid into the computer.

An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

Custom cooling strategies may be implemented for different regions in computers, servers, and other information handling systems. Chassis architecture may have multiple cooling fans, with each fan cooling a different region via dedicated duct work. A user or administrator may thus implement different cooling strategies for internal components, based on different thermal curves defined for each different region.

The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.

A computing rack apparatus which reduces the manufacturing cost by simplifying the structure thereof and in which the temperature of the internal air is utilized in the cooling unit is disclosed. The apparatus comprises: a rack housing which houses a server, a rack frame which is disposed inside the rack housing and on which the server is fastened and mounted; and a cooling unit which has a discharge port which is disposed inside the rack housing and discharges cooling air and a suction port which sucks the internal air through a cooling zone, wherein the discharge port is located in a first region with respect to a boundary portion defined by a front surface of the server, and the suction port is located in a second region with respect to the boundary portion, and the first and second regions form the cooling zone.