One aspect is directed to a system for controlling airflow in a facility having a ceiling-ducted aisle airflow containment system having a first damper system for controlling airflow. The system includes an input to receive parameters related to airflow in the facility, wherein the parameters include at least one airflow resistance value for a device in the facility, an output to provide output data including at least one setting for one or more controllable devices in the facility, and one or more processors configured to receive the parameters related to airflow, determine airflow values associated with the airflow containment system and based on the airflow values, generate the at least one setting for the one or more controllable devices, including at least one setting for the first damper system.

A system includes multiple MHACUs for cooling one or more servers in a data hall. The system also includes a pump package for providing cooling fluid to the MHACUs, and a fluid supply line conveying the cooling fluid to the MHACUs. The system also includes at least one computing device configured to: determine that a cooling fluid temperature in a first MHACU has risen to a first temperature that is less than a predetermined maximum temperature; in response to the determination, control the system to provide at least some of the cooling fluid to a second MHACU; determine that the cooling fluid temperature in the second MHACU has risen to a second temperature that is at least the predetermined maximum temperature; and in response to the determination, control the system to provide the cooling fluid to a fluid return line for return to the pump package.

A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.

A system and method for energy harvesting in a data center has one or more collection devices, a thermoelectric device, and a controller for directing the operation of the thermoelectric device and other equipment in the data center. The waste heat generated by the servers in the data center is harnessed and directed into the thermoelectric device where the waste heat is converted to usable electrical energy under the direction of the controller. The recycled electrical energy is then combined with utility-input power and provided to the servers and other equipment in the data center for consumption.

A self-sustained, submerged waterborne data center facility that utilizes a closed-looped heat management system that is both energy-efficient and cost-effective is disclosed. Embodiments employ a closed-looped, energy efficient, cost effective thermal management system that leverages natural resources to control thermal conditions and reduce the overall requirement for cooling power.

A cooling unit includes a heat exchanger coil positioned coupled to a source of fluid. The heat exchanger includes at least one coil configured to face air being drawn through the heat exchanger. The at least one coil has a first pipe, a second pipe spaced from the first pipe, and a plurality of micro-channels disposed between and in fluid communication with the first pipe and the second pipe. Each of the first pipe, the second pipe and the plurality of micro-channels is configured to enable a countercurrent configuration between inner and outer fluids. Other embodiments of the cooling unit and methods of cooling are further disclosed.

A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.

The present invention includes a cartridge and system utilizing the cartridge that cools a computer. The cartridge first within a server stand and urges forced fluid into the computer.

A method comprises performing an analysis of airflow and temperature distribution in an indoor environment utilizing a hybrid turbulence model including a Chen-Xu model used for analysis of bulk flow and a wall function used in first grid cells bounding solid objects in the indoor environment and adjusting physical layout and/or operating parameters of heat producing electrical equipment and/or a cooling system of the indoor environment responsive to results of the analysis to improve one of temperature distribution within the indoor environment and operating efficiency of the cooling system of the indoor environment.

The present disclosure is directed to examples of modular data centers configured to provide cooling to liquid-cooled electronics equipment stored within the modular data centers. In one aspect, a modular data center can be configured to provide cooling without requiring the use of mechanical refrigeration (e.g. vapor-compression or absorption refrigeration), through the use of a dry cooler in combination with an optional evaporative cooler.