A two-phase immersion cooling device includes a box body, a plurality of heating elements, a condenser, a cover body, and at least one fan. The box body includes a plurality of side walls and a bottom wall, the side walls are connected to each other top to bottom, the bottom wall is connected to one end of the side walls, the side walls and the bottom wall jointly form an accommodating cavity, and the accommodating cavity contains coolant. The condenser is received in the accommodating cavity, and is arranged along sidewalls of the tank. An upper cavity surrounded by the condenser is defined. The cover body covers the box body to seal the accommodating cavity, the cover body expands on the box body to expose the accommodating cavity to outside. At least one fan is fixedly disposed on the cover body and is accommodated in the upper cavity.

According to one embodiment, a server chassis for immersion cooling includes a chassis frame having a chassis base and an adjustable server panel coupled to the chassis base to receive a server blade to be mounted on the adjustable server panel. The server blade includes a first portion and a second portion. The first portion has a first set of electronic components and the second portion has a second set of electronic components. The adjustable server panel is adjustably mounted along the chassis base, such that when the server chassis is deposited into a container having two-phase coolant therein, the first set of electronic components is at least partially submerged into a liquid region filled with the two-phase coolant, and the second set of electronic components is positioned within a vapor region above an immersion line defining the liquid region and the vapor region.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

A two-phase immersion cooling device includes an upper box body, a lower box body, a plurality of heating elements, and a condenser. The walls of the upper box body form a first cavity. The lower box body defines a second cavity containing coolant. The heating elements are disposed in the second cavity and immersing in the coolant. The condenser in the upper box body includes multiple rows and columns of condensing tubes, is arranged across or along the upper box body to fill the first cavity. The lower box body is detachably and hermetically connected to the bottom of the upper box body, connecting the second cavity with the first cavity to form an accommodating cavity.

A cooling system includes an evaporator, connected through fluid lines to a first condenser, a second condenser, a compressor, and a thermal expansion valve. One or more valves are arranged in the fluid lines. The one or more valves operated to, in a first mode, circulate fluid between the evaporator the first condenser; in a second mode, circulate the fluid between a) the evaporator and the first condenser, and b) the evaporator, the second condenser, and the thermal expansion valve, and; in a third mode, circulate the fluid between a) the evaporator and the first condenser, and c) the evaporator, the compressor, the second condenser, and the thermal expansion valve.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

Embodiments are disclosed of an information technology (IT) cooling system. An IT container defines an internal volume and an immersion tank-which is adapted to submerge one or more servers in a two-phase immersion fluid and has a tank inlet fluidly coupled to a source of the two-phase immersion fluid. One or more cooling devices can be thermally coupled to a heat-generating component in a server, and each cooling device has a liquid inlet at or near its bottom and a vapor outlet at or near its top. A liquid distribution manifold below the cooling devices has a main liquid inlet and a plurality of liquid distribution outlets; at least one liquid distribution outlet is fluidly coupled to the liquid inlet of a cooling device. A vapor return above the one or more cooling devices has a plurality of vapor collection inlets and a main vapor outlet. At least one vapor collection inlet is fluidly coupled to the vapor outlet of a cooling device, so that a second two-phase fluid circulates through the liquid distribution manifold, the cooling devices, and the vapor return manifold.

A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

A thermal management system includes a boiler tank and at least one heat-generating component positioned in the boiler tank. The boiler tank is in fluid communication with a vapor return line and a liquid return line. A condenser is in fluid communication with the vapor return line and the liquid return line. The condenser is positioned between vapor return line and the liquid return line in the fluid communication.