A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

A power module includes at least two power units. Each power unit includes at least one power semiconductor and a substrate. In order to reduce the installation space required for the power module and to improve cooling, the at least one power semiconductor is connected, in particular in a materially bonded manner, to the substrate. The substrates of the at least two power units are each directly connected in a materially bonded manner to a surface of a common heat sink. A power converter having at least one power module is also disclosed.

A mechanical enclosure for a power converter is disclosed. In some embodiments, the mechanical enclosure comprises a base; a first compartment configured for receiving one or more electronic devices; and a second compartment configured for receiving a magnetic device, the second compartment formed by a cavity protruding from a bottom surface of the base.

A power converter includes a PCB having opposing first and second sides, and a plurality of first commutation units and first capacitor unit disposed on the PCB. Each first commutation unit includes a first discrete component and a second discrete component. The second end of the first discrete component is electrically coupled to the first end of the second discrete component, and the first capacitor unit is electrically coupled to the first ends of the first discrete components and the second ends of the second discrete components in the plurality of first commutation units, respectively. The first discrete components and the second discrete components in the plurality of first commutation units are arranged in a row. The first discrete component and the second discrete component in each first commutation unit form a commutation loop together with the first capacitor unit.

The present invention relates to a modular solar photovoltaic inverter where by reducing the size of the filtering module and reducing the number of components, it reduces the size of the solar inverter compared to the state of the art; and with the configuration of the power modules, it generates channels that allow the passage of air from the cooling module, obtaining a modular photovoltaic solar inverter that improves the dimensions, weight, maintenance, cooling and safety with respect to those known up until now.

A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow.

A vehicle mounted electrical power converter includes: a heatsink; a circuit board placed on or above the heatsink; a power semiconductor device mounted on or above the circuit board; a control board support base that is placed on and/or above the circuit board and that supports a control board; and a heat transfer member being interposed between the power semiconductor device and the control board support base and thermally coupling between the power semiconductor device and the control board support base.

The invention is a power electronic system comprising at least one power electronic component implemented at least partly on at least one circuit board. The circuit boards are planar and circular or toroidal in shape with the center thereof comprising a circular opening having a diameter D cooperating with a hose for circulating a flow.

An electric fan for producing thrust to propel an aircraft is disclosed. The electric fan comprises a stator, a fan rotor rotatably mounted relative to the stator and an electric motor mounted to the stator and drivingly engaged with the fan rotor to cause rotation of the fan rotor relative to the stator. The fan rotor comprises an annular body defining a flow passage therethrough and a plurality of fan blades disposed in the flow passage and mounted for common rotation with the annular body about a fan rotation axis. The electric motor has a motor rotation axis that differs from the fan rotation axis.

The motor driving device is to be mounted to a control panel, and includes: a motor driving device main body; a radiator disposed to face a rear surface of the motor driving device main body; a fan motor unit being disposed above the radiator and being withdrawable through an area above the motor driving device main body; and a floor sheet member configured to be laid out along a withdrawal route of the fan motor unit in a process of withdrawing the fan motor unit.