A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Electronic devices are disclosed including hydrophobic or oleophobic coatings that control coolant flow therein or thereon. In at least one embodiment, a power inverter cold plate is provided including coolant inlet, a coolant outlet, a coolant flow spreading region, a coolant flow collection region, and a coolant heat-transfer region disposed therebetween; and one or more layers of a hydrophobic or oleophobic coating configured to control a flow of coolant in the cold plate. A method may include applying one or more layers of a hydrophobic or oleophobic coating to a power inverter cold plate to control a flow of coolant in the cold plate, the one or more layers being applied to one or more of a coolant flow spreading region, a coolant flow collection region, or a coolant heat-transfer region disposed therebetween. The layers may define coolant flow paths, eliminate recirculation zones, and/or prevent coolant leak paths.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

A vehicle-mounted inverter skid wherein the bottom plate of a box body (100) is equipped with a plurality of support beams (105), and the height of the support beams (105) is less than the height of a support frame (104), such that the box body (100) is a sunken structure relative to the support frame (104), and the height dimension of the box body (100) is reduced by it being sunken in the direction of the support frame (104); a wire feed-in assembly of a wire feed-in unit (200) comprises a wire feed-in terminal (202) and a wire feed-in bracket (203); the wire feed-in bracket (203) is shaped like the Chinese character for a door, its top plate is provided with an wire feed-in hole (2031), and the wire feed-in terminal (202) is vertically insertedly disposed in the wire feed-in hole (2031) for fixing; the bottom plate of the box body (100) has a wire feed-in port (204) corresponding to the location of the wire feed-in hole (2031), such that the wire feed-in terminal (202) is arranged vertically, reducing the horizontal footprint of the wire feed-in assembly; combined with a magnetic excitation assembly (205) of the wire feed-in unit (200) being separated and arranged in the vacant space on the side of a transformer unit (300), the length and width of the inverter sled are reduced, thus reducing the overall volume of the inverter skid, solving the technical problem of the large size of existing inverter sleds and making it more suitable for vehicle-mounted use.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

The integrated dual-motor controller includes a controller housing, a bus magnetic ring component, an all-in-one module, a control plate, an isolation plate and a drive plate. The bus magnetic ring component, the all-in-one module, the control plate, the isolation plate and the drive plate are all integrated in the controller housing. The integrated dual-motor controller is designed to achieve a high level of integration, and a modular design is used inside to facilitate mounting and reduce the size.