A cooling type housing (100) for housing a heating element (50) inside, including: an assembled metal housing (10); and a cooling flow path (30) provided at least on one surface (10A) of the metal housing (10), in which a heat medium flows, in which the cooling flow path (30) constitutes at least a part of the one surface (10A) of the metal housing (10).

Cooling device (15) for cooling semiconductor switching elements (10, 11), comprising a first wall (17) having a first side (18) for carrying the semiconductor switching elements (10, 11) and having a second side (19) being opposite the first side (18), a second wall (20) having a first side (21) that forms a main cooling channel (22) together with the second side (19) of the first wall (17) and having a second side (25) being opposite to the first side (21) of the second wall (20), and a third wall (23) that forms an auxiliary cooling channel (24) together with the second side (25) of the second wall (20), wherein the second wall (20) comprises a connection means (26) that connects the auxiliary cooling channel (24) with the main cooling channel (22) in a fluid-conductive manner.

A heat exchanger includes a plurality of fins that are spaced from each other and are arranged to divide a heat medium flow passage into a plurality of narrow passages. Each fin incudes a plurality of thick wall portions and a plurality of thin wall portions which are alternately arranged in a passage longitudinal direction. Each adjacent two of the plurality of fins, which are adjacent to each other, are defined as one fine and another fin, and each of the plurality of thick wall portions of the one fin is opposed to an adjacent one of the plurality of thin wall portions of the another fin in a fin arrangement direction, and each of the plurality of thin wall portions of the one fin is opposed to an adjacent one of the plurality of thick wall portions of the another fin in the fin arrangement direction.

A power converter apparatus includes a power module assembly including a power module and a cooler overlapping with the power module to allow the cooler to cover both sides of the power module, and a capacitor and a low voltage direct-current (DC)-DC converter (LDC) which are coupled in a state of pressing the power module assembly on both sides of the power module assembly.

Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

A powertrain is provided, including: a motor control unit (1) including a housing (11) and a first functional unit (12) disposed in the housing (11) and capable of generating heat during operation; and a heat exchanger (2) disposed in the housing (11), where the heat exchanger (2) includes a first circulation channel (21) for a first cooling medium to circulate and a second circulation channel (22) for a second cooling medium to circulate. The first circulation channel (21) has a first external cooling surface (P1), and the first circulation channel (21) conducts heat with the first functional unit (12) at the first external cooling surface (P1); and/or the first circulation channel (21) has a second external cooling surface (P2), and the first circulation channel (21) conducts heat with an inner surface of the housing (11) at the second external cooling surface (P2).

A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

An electronic device for a motor vehicle, includes a first housing portion to receive one or more first electronic components, a second housing portion to receive one or more second electronic components, the second housing assembled with the first housing, and a coolant fluid inlet and a coolant fluid outlet, a coolant channel being provided in the electronic device for the coolant fluid flowing from the inlet to the outlet so as to cool all or part of the first electronic components and/or all or part of the second electronic components, said channel having, over most of the course thereof in the device, in particular over the whole of the course thereof in the device, a section perpendicular to the flow direction of the fluid which is: exclusively provided in the first housing portion or exclusively provided in the second housing portion.

A container type variable-frequency drive skid includes a container body, wherein a containing space is provided in the container body, a wiring unit, a voltage transformation unit and a frequency conversion unit are arranged in the containing space, a first cooling unit and a second cooling unit are further arranged in the containing space, the first cooling unit comprises an air duct and a first heat dissipation fan arranged in the air duct, the voltage transformation unit is located in the air duct, air flows through the air duct under the action of the first heat dissipation fan to cool the voltage transformation unit, the second cooling unit comprises a cold guide assembly and a second heat dissipation fan, and the cold guide assembly abuts against the frequency conversion unit. The first cooling unit cools the voltage transformation unit in an air-cooling manner, and the second cooling unit cools the frequency conversion unit in an air cooling and water-cooling combined manner, such that the situation that the voltage transformation unit and the frequency conversion unit cannot operate normally due to too high a temperature is avoided, and the operation efficiency and reliability of the whole machine are improved.