An inverter device (1), comprising a first printed circuit board (2) on which a transformer (3) is arranged; a second printed circuit board (4) which is arranged parallel to the first printed circuit board (2) at a distance from the sides of the transformer (3); and a cover element (5) which is arranged between the printed circuit boards (2, 4) for the purpose of electromagnetic shielding and has a through opening (6) through which the transformer (3) passes;
wherein the cover element (5) comprises a shielding unit (7) which surrounds the through opening (6) peripherally at least in some places and extends in the direction of the second printed circuit board (4).

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

A display device includes a display panel, a printed circuit board attached to the display panel and including a ground potential supply terminal, a circuit, and a wiring pattern electrically coupling the ground potential supply terminal and the circuit, and a housing that contacts a coupling place provided to the wiring pattern and is attached to the printed circuit board through the coupling place. The wiring pattern includes a terminal wiring pattern electrically coupled with the ground potential supply terminal, a circuit wiring pattern branched from a branch part at a predetermined position on the terminal wiring pattern and electrically coupled with the circuit, and a housing wiring pattern branched from the branch part of the terminal wiring pattern and electrically coupled with the coupling place, and the circuit wiring pattern and the housing wiring pattern are uncoupled with each other at any place other than the branch part.

According to the disclosure, an electronic device may include a printed circuit board, a first component disposed on one surface of the printed circuit board, a second component disposed on the other surface of the printed circuit board, and a metal structure configured to shield electromagnetic interference (EMI) related to the first component, wherein the metal structure includes a first portion configured to cover at least a part of the first component, and a second portion configured to extend from the first portion through the printed circuit board so as to support the second component. Various other embodiments may be possible.

Disclosed is a hearing device configured to be worn at or in an ear of a user. The hearing device comprises a substrate. The substrate comprises one or more electronic components mounted on the substrate. The hearing device comprises a shielding component. The shielding component being arranged on the substrate to provide a space between the shielding component and the substrate. The shielding component is configured to cover at least a first electronic component of the one or more electronic components on the substrate. The space between the shielding component and the substrate is at least partly filled with a fill encapsulation material configured for encapsulating at least the first electronic component. The shielding component comprises a reservoir configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component and the substrate.

A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.

A communication device includes a communication connector, a communication control circuit, and a common mode filter. The communication control circuit controls communication that is established by way of the communication connector. The common mode filter is connected to each of the communication control circuit and the communication connector to relay the communication. Letting a wavelength corresponding to a clock frequency of an electric signal sent out from the communication control circuit be denoted as λ, an electrical length of a signal path at which resonance is produced by a reflected wave resulting from reflection of the electric signal by the common mode filter is closer to an even multiple of λ/2 than to an odd multiple thereof.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

An electronic apparatus includes a printed board and an electroconductive shield member disposed such as to cover a shield area which is a part of a front surface of the printed board. A wiring connecting an inside and an outside of the shield area is disposed on the front surface of the printed board. The shield member has an opening that connects an inside and an outside of the shield member, at a position where the wiring passes through an outer edge of the shield area, and that extends in an extending direction of the wiring. The opening is electrically connected to a conductor disposed on an opposite side of the wiring from the opening, and the opening and the conductor form a waveguide surrounding the wiring.