Patent classifications
H10K50/8445
FLUORINE-CONTAINING PLASMA POLYMERIZED HMDSO FOR OLED THIN FILM ENCAPSULATION
Methods for forming an OLED device are described. An encapsulation structure having organic buffer layer sandwiched between barrier layers is deposited over an OLED structure. The buffer layer is formed with a fluorine-containing plasma. The second barrier layer is then deposited over the buffer layer. Additionally, to ensure good adhesion, a buffer adhesion layer is formed between the buffer layer and the first barrier layer. Finally, to ensure good transmittance, a stress reduction layer is deposited between the buffer layer and the second barrier layer.
PASSIVATION STRUCTURE AND METHOD OF MAKING THE SAME
A passivation structure includes a bottom dielectric layer. The passivation structure further includes a doped dielectric layer over the bottom dielectric layer. The doped dielectric layer includes a first doped layer and a second doped layer. The passivation structure further includes a top dielectric layer over the doped dielectric layer.
DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
The present disclosure provides a display substrate, comprising: a bending resistant region; the region comprises a base and a metal wire layer, wherein the metal wire layer is directly formed on the base, or the region further comprises an organic buffer layer located between the base and the metal wire layer, and the metal wire layer is directly formed on the organic buffer layer. The present disclosure provides a method for manufacturing the display substrate above-described. The present disclosure further provides a display device, comprising the display substrate above-described. The present disclosure further provides a method for manufacturing the display device, comprising the method for manufacturing the display substrate above-described. The present disclosure forms a bending resistant structure in a predetermined bending resistant region on the bezel portions of the display substrate, which can enhance the bend resistance thereof and improve the quality of the flexible display.
PROCESS FOR PRODUCING FLEXIBLE ORGANIC-INORGANIC LAMINATES
Processes for producing flexible organic-inorganic laminates by atomic layer deposition are described, as well as barrier films comprising flexible organic-inorganic laminates. In particular, a process for producing a laminate including (a) depositing an inorganic layer by an atomic layer deposition process, and (b) depositing an organic layer comprising selenium by a molecular layer deposition process is provided.
ORGANIC LIGHT-EMITTING DISPLAY DEVICE
An organic light-emitting display device with improved light efficiency includes a plurality of pixel electrodes each corresponding one of at least a first, second, or third pixel; a pixel-defining layer covering an edge and exposing a central portion of the pixel electrodes; an intermediate layer over the pixel electrode and including an emission layer; an opposite electrode over the intermediate layer; and a lens layer over the opposite electrode and including a plurality of condensing lenses each having a circular lower surface. For the first pixel, a ratio B/A ranges from about 1.34 to about 2.63. For the second pixel, B/A ranges from about 1.43 to about 3.00, For the third pixel, B/A ranges from about 1.30 to about 2.43. An area of the portion of the pixel electrode exposed by the pixel-defining layer is A, and an area of the lower surface of the condensing lens is B.
Thin film transistor substrate
An organic electroluminescence display device includes: a lower electrode that is made of a conductive inorganic material and formed in each of pixels arranged in a matrix in a display area; a light-emitting organic layer that is in contact with the lower electrode and made of a plurality of different organic material layers including a light-emitting layer emitting light; an upper electrode that is in contact with the light-emitting organic layer, formed so as to cover the whole of the display area, and made of a conductive inorganic material; and a conductive organic layer that is in contact with the upper electrode, formed so as to cover the whole of the display area, and made of a conductive organic material.
PLASTIC SUBSTRATE WITH IMPROVED HARDNESS AND DISPLAY DEVICE INCLUDING THE SAME
A plastic substrate includes: a plastic support member having light transmittance; and a first organic-inorganic hybrid layer on the plastic support member. The first organic-inorganic hybrid layer includes: a first organic-inorganic hybrid matrix; and ions implanted into the first organic-inorganic hybrid matrix at a side opposite to a side adjacent the plastic support member. An amount of the ions per unit area is in a range from about 2×10.sup.13/cm.sup.2 to about 2×10.sup.14/cm.sup.2.
ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE
An display device including a substrate, an organic light-emitting diode, and a thin film encapsulation layer. The organic light-emitting diode is disposed on the substrate. The thin film encapsulation layer is disposed on the organic light-emitting diode. The thin film encapsulation layer includes at least one inorganic layer, at least one organic layer, and a first refractive-index control layer. The at least one organic layer is alternately disposed with the at least one inorganic layer. The first refractive-index layer is disposed between one of the at least one inorganic layer and one of the at least one organic layer disposed adjacent to each other. The first refractive-index control layer has a refractive-index variation ratio per unit length (Δn/nm) from about 0.001/nm to about 0.002/nm along a direction from the organic light-emitting diode toward the thin film encapsulation layer.
DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME
A display device includes: a substrate including a front surface, side surfaces extending from sides of the front surface, and a corner between the side surfaces; a first display area at the front surface and including a first pixel electrode, a first emissive layer disposed on the first pixel electrode, and a first common electrode on the first emissive layer; a second display area at the corner and including a second pixel electrode, a second emissive layer on the second pixel electrode, and a second common electrode on the second emissive layer; a first inorganic encapsulation layer on the first common electrode and the second common electrode; an organic encapsulation layer on the first inorganic encapsulation layer in the first display area; and a second inorganic encapsulation layer on the organic encapsulation layer in the first display area and on the first inorganic encapsulation layer in the second display area.
Multilayer encapsulation, method for encapsulating and optoelectronic component
A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.