The present invention provides a display panel and a manufacturing method thereof, wherein the display panel includes: a thin-film transistor array substrate; an anode disposed on the thin-film transistor array substrate; a pixel definition layer disposed on the anode and the thin-film transistor array substrate, wherein the pixel definition layer includes a first area and a second area, the first area is provided with an opening, a bottom of the opening is connected to the anode, and the second area is provided with a plurality of grooves; a light-emitting layer disposed in the opening; a cathode covering the light-emitting layer and the pixel definition layer; and an encapsulation layer covering the cathode.

A flexible substrate is provided, and the flexible substrate includes a second organic layer, a first inorganic layer, a first organic layer, and a second inorganic layer, which are sequentially stacked. A surface, which is in contact with the first organic layer, of the first inorganic layer has a first groove. A surface, which is in contact with the first inorganic layer, of the second organic layer has a second groove. A surface, which is in contact with the second inorganic layer, of the first organic layer has a third groove. In a direction perpendicular to the first inorganic layer, any two of the first groove, the second groove and the third groove at least partially are not aligned with each other. A manufacturing method of the flexible substrate, a panel including the flexible substrate, and an electronic device including the flexible substrate are also provided.

Disclosed is a display device comprising: a substrate comprising a display area in which pixel areas are disposed and a non-display area adjacent to the display area; light emitting portions disposed in the display area and comprising at least one of the pixel areas; the light emitting portions emitting light through the pixel areas; connecting portions connecting the light emitting portions; a bank defining the light emitting portions and the connecting portions; and a light emitting layer formed on the light emitting portions and the connecting portions.

A film-forming composition according to the present invention include fluororesin having a repeating unit of the general formula (1); and a fluorine-containing solvent. ##STR00001##
In the general formula (1), R.sup.1 each independently represents a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; and R.sup.2 each independently represents C.sub.1-C.sub.15 straight, C.sub.3-C.sub.15 branched or C.sub.3-C.sub.15cyclic fluorine-containing hydrocarbon gr which any hydrogen atom may be replaced by a fluorine atom with the proviso that the repeating unit contains at least one fluorine atom. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element because the composition can form a film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.

The present disclosure provides a method of patterning a polymeric layer based on the chemical reaction of two chemical compounds. One chemical compound is provided in the polymeric layer and another chemical compound is deposited on the polymeric layer by, for example, ink-jet printing. The method allows for fabrication of, for example, metallisation patterns for solar cells electronic components, integrated devices and formation of selective doped areas in solar cells amongst others.

An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

A flexible substrate and a manufacturing method thereof, a panel and an electronic device are provided. The flexible substrate includes a first inorganic layer and a first organic layer; the first organic layer is on the first inorganic layer and in contact with the first inorganic layer, and a surface, which is in contact with the first organic layer, of the first inorganic layer has a first groove.

The present disclosure provides a method for patterning a nanoparticle layer, including steps of: (S1) connecting a first base to a surface of a predetermined area of a substrate, to form a substrate modified with the first base in the predetermined area of the substrate; (S2) depositing the nanoparticle in the predetermined area of the substrate, to form a nanoparticle layer in the predetermined area of the substrate by self-assembling, a ligand of the nanoparticle includes a second base, and the first base and the second base being connected by a hydrogen bond; and (S3) removing the nanoparticle in a non-predetermined area of the substrate.

A display device includes: a thin-film transistor on a substrate, the thin-film transistor including on the substrate: an active layer; a gate electrode overlapping the active layer; a source electrode and a drain electrode electrically connected to the active layer and including a first metal material; and a first capping layer which covers each of the source electrode and the drain electrode, the first capping layer having a Young's modulus greater than that of the first metal material.