A method of manufacture and resulting structure for a single crystal electronic device with an enhanced strain interface region. The method of manufacture can include forming a nucleation layer overlying a substrate and forming a first and second single crystal layer overlying the nucleation layer. This first and second layers can be doped by introducing one or more impurity species to form a strained single crystal layers. The first and second strained layers can be aligned along the same crystallographic direction to form a strained single crystal bi-layer having an enhanced strain interface region. Using this enhanced single crystal bi-layer to form active or passive devices results in improved physical characteristics, such as enhanced photon velocity or improved density charges.

A method is for detecting a condition associated with a final phase of a plasma dicing process. The method includes providing a non-metallic substrate having a plurality of dicing lanes defined thereon, plasma etching through the substrate along the dicing lanes, wherein during the plasma etching infrared emission emanating from at least a portion of the dicing lanes is monitored so that an increase in infrared emission from the dicing lanes is observed as the final phase of the plasma dicing operation is entered, and detecting the condition associated with the final phase of the plasma dicing from the monitored infrared emission.

The structure of a mother piezoelectric element allows a polarization process to be performed on the mother body before the individual piezoelectric elements are cut from the mother piezoelectric element. The mother piezoelectric element includes a plurality of first internal electrodes which are provided on at least one first surface and a plurality of second internal electrodes which are provided on at least one second surface. Each of the first and second internal electrodes is led out to any of first to fourth side surfaces of a mother piezoelectric body. The plurality of first internal electrodes are electrically connected to each other on a first surface and the plurality of second internal electrodes are electrical connected to each other on a second surface. All the first internal electrodes in the mother piezoelectric body are electrically connected to each other, and all the second internal electrodes in the mother piezoelectric body are electrically connected to each other.

A crystal element includes a vibration part, a holding part, an electrode part, and a recess that corresponds to a recess and/or protrusion. The vibration part has a pair of vibration-part main surfaces. The holding part is formed integrally with the vibration part to be connected to an outer edge of vibration part and has a pair of holding-part main surfaces and holding-part side surfaces. The electrode part is provided at the vibration-part main surfaces. The recess is located at the holding-part side surfaces.

A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.

A very small piezoelectric sensor capable of being mass produced includes a core, a piezoelectric layer on a surface of the core; and a conductive layer on a surface of the piezoelectric layer away from the core. The core is flexible and threadlike, the core is a first electrode of the piezoelectric sensor, and the conductive layer is a second electrode of the piezoelectric sensor. An array of such sensors allows the “skin” of a robot for example to simulate the sensitivity of hair-covered human skin. A method for making the piezoelectric sensor and an electronic device using the piezoelectric sensor are also disclosed.

Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.

Proposed is a method of manufacturing a piezoelectric composite material. The method includes the steps: wet mixing the ceramic powder, the polymer binder, the plasticizer, and the solvent for 4 to 72 hours to produce the mixed slurry, in which the amount of the polymer binder in the mixed slurry is 3 to 10 parts by weight, the amount of the plasticizer is 0.1 to 3 parts by weight, and the amount of the solvent is 30 or more to less than 50 parts by weight, based on 100 parts by weight of the ceramic powder in the mixed slurry; introducing the mixed slurry into a tape casting process to produce a piezoelectric composite sheet; drying and molding the piezoelectric composite sheet in a roll-to-roll process to form a molded piezoelectric composite sheet; laminating and compressing piezoelectric composite sheets molded to produce piezoelectric composite sheet laminates; and cutting the piezoelectric composite sheet laminate into the desired shape and size.

A radial type ultrasound transducer is arranged in an ultrasound endoscope including a bending portion on a distal end side of an insertion portion. The ultrasound transducer includes: a plurality of piezoelectric elements arranged at predetermined intervals in a circumferential manner and configured to transmit and receive ultrasound waves; a plurality of electrodes arranged in the respective piezoelectric elements; and a flexible printed circuit electrically connected to each of the electrodes. The flexible printed circuit includes a plurality of wires that extend such that at least parts of the wires cross a direction perpendicular to an arrangement direction of the piezoelectric elements, and the plurality of wires are electrically connected to the respective electrodes of the piezoelectric elements at positions where at least parts of the wires cross the direction perpendicular to the arrangement direction of the piezoelectric elements.

A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.