A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.

A semiconductor memory device includes a substrate, a dielectric layer on the substrate, and a contact plug in the dielectric layer. An upper portion of the contact plug protrudes from a top surface of the dielectric layer. The upper portion of the contact plug acts as a first electrode. A buffer layer is disposed on the dielectric layer and beside the upper portion of the contact plug. A resistive-switching layer is disposed beside the buffer layer. A second electrode is disposed beside the resistive-switching layer.

A 3D semiconductor device including: a first single crystal layer with first transistors; overlaid by a first metal layer; a second metal layer overlaying the first metal layer and being overlaid by a third metal layer; a logic gates including at least the first metal layer interconnecting the first transistors; second transistors disposed atop the third metal layer; third transistors disposed atop the second transistors; a top metal layer disposed atop the third transistors; and a memory array including word-lines, and at least four memory mini arrays, where each of the memory mini arrays includes at least four rows by four columns of memory cells, where each of the memory cells includes at least one of the second transistors or third transistors, sense amplifier circuit(s) for each of the memory mini arrays, the second metal layer provides a greater current carrying capacity than the third metal layer.

Provided is a memory device and an electronic device including the same. The memory device according to an example embodiment may include: a two-dimensional material layer including a two-dimensional material; a contact region in contact with an edge of the two-dimensional material layer; and an electrode which is electrically connected to the contact region and changes a domain of a region adjacent to the contact region of the two-dimensional material layer by an applied voltage.

A method of manufacturing a semiconductor device includes forming holes passing through a stacked structure, surrounding channel structures, and replacing some of the materials of the stacked structure through the holes.

A conductive bridge random access memory and its manufacturing method are provided. The conductive bridge random access memory includes a bottom electrode, an inter-metal dielectric, a resistance switching assembly, and a top electrode. The bottom electrode is disposed on a substrate, and the inter-metal dielectric is disposed above the bottom electrode. The resistance switching assembly is disposed on the bottom electrode and positioned in the inter-metal dielectric. The resistance switching assembly has a reverse T-shape cross-section. The top electrode is disposed on the resistance switching assembly and the inter-metal dielectric.

The present disclosure includes three dimensional memory arrays. An embodiment includes a first plurality of conductive lines separated from one another by an insulation material, a second plurality of conductive lines arranged to extend substantially perpendicular to and pass through the first plurality of conductive lines and the insulation material, and a storage element material formed between the first and second plurality of conductive lines where the second plurality of conductive lines pass through the first plurality of conductive lines. The storage element material is between and in direct contact with a first portion of each respective one of the first plurality of conductive lines and a portion of a first one of the second plurality of conductive lines, and a second portion of each respective one of the first plurality of conductive lines and a portion of a second one of the second plurality of conductive lines.

In a semiconductor device, a device structure is positioned over a substrate, where the device structure includes devices. A wiring structure of the semiconductor device is positioned over the substrate and coupled to at least one of the devices. The wiring structure includes at least one of programmable lines and programmable vertical interconnects, where the programmable lines extend along a top surface of the substrate and the programmable vertical interconnects extend along a vertical direction perpendicular to the top surface of the substrate. The programmable lines and the programmable vertical interconnects include a programmable material having a modifiable resistivity in that the programmable lines and the programmable vertical interconnects change between being conductive and being non-conductive in responsive to a current pattern delivered to the programmable lines and the programmable vertical interconnects.

Proposed are a layered Group III-V compound having ferroelectric properties, a Group III-V compound nanosheet that may be prepared using the same, and an electrical device including the materials. Proposed is a layered compound represented by [Formula 1] M.sub.x−mA.sub.yB.sub.z (M is at least one of Group I or Group II elements, A is at least one of Group III elements, B is at least one of Group V elements, x, y, and z are positive numbers which are determined according to stoichiometric ratios to ensure charge balance when m is 0, and 0<m<x), and having ferroelectric-like properties.

A semiconductor device includes a substrate, a plurality of word line structures disposed over the substrate to be spaced apart from each other in a first direction perpendicular to a surface of the substrate. Each of the plurality of word line structures extends in a second direction parallel to the surface of the substrate. In addition, the semiconductor device includes a switching layer disposed over the substrate to contact side surfaces of the plurality of word line structures, and bit line structures disposed over the substrate to extend in the first direction and to contact a surface of the switching layer. The switching layer is configured to perform a threshold switching operation, and has a variable programmable threshold voltage.