Patent classifications
Y10T156/1089
Multi-Layer Decorating Element and Method of its Manufacture
A multi-layer decorating element includes a base and a plurality of plates forming decorative elements. The base has a length between the first and second ends thereof and an increased width from the first end to the second end. The first end of the base is curved. The second end of the base is divided by a gap into two segments. The gap has a closed end and an open end. The open end is disposed at the second end of the base. The closed end has a smaller width than the open end. The plurality of plates includes a side with a hot melt glue layer and is hot pressed on a side of the base. The plurality of plates is disposed within peripheral edges of the base and includes a plurality of overlapped sections. The plurality of plates has different shapes.
Transferring assembly for transferring a radiofrequency identification device onto an object
A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.
Method and apparatus for joining screen material for minimal optical distortion
The present disclosure describes a manufacturing method for seaming materials. The process may be suitable for manufacturing high performance projection screens using a number of methods including, but not limited to, conventional (convert-before-coating) methods, or convert-after-coating methods. An objective of the present disclosure is to identify a process which may substantially minimize distortion of the local surface normal in the vicinity of the join.
Lamination of electrochromic device to glass substrates
Electrochromic device laminates and their method of manufacture are disclosed.
Ball, particularly for basketball practice, and corresponding manufacture method
A ball useful for basketball practice and a method for manufacturing the same are provided. The ball includes an inflatable bladder covered with one or more flexible elongate elements wound around the surface of the bladder. The ball also includes an outer covering with at least two outer panels separated by at least one strip of elastomeric material. The outer panels and the strip(s) are placed directly onto the wound flexible elongate element(s). The manufacture-method particularly involves covering the inflatable bladder with the flexible elongate element(s) wound on the surface of the bladder, and placing the outer covering, including the outer panels separated by the strip(s) of elastomeric material, directly onto the wound flexible elongate element(s).
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
Apparatus for molecular adhesion bonding with compensation for radial misalignment
A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
Method for producing bandages
In a method for producing bandages such as support bandages for knee and elbow joints, an elastic fabric material layer is provided on which reinforcement elements are placed and an uncured elastomer is applied to the fabric material in several layers or sprayed onto the fabric material layer so as to completely cover and embed the reinforcement elements which are firmly engaged thereby with the fabric material layer and form three-dimensional stabilizing structures projecting from the surface of the fabric material layer.
METHODS OF MAKING A CORE LAYER FOR AN INFORMATION CARRYING CARD, AND RESULTING PRODUCTS
The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.
Tape carrier assemblies having an integrated adhesive film
Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.