A conductive transfer for application to a surface of a wearable item comprises a first non-conductive ink layer and a second non-conductive ink layer. An electrically conductive layer is positioned between the first non-conductive ink layer and the second non-conductive ink layer. The conductive transfer also comprises an adhesive layer for adhering the conductive transfer to the surface of the wearable item. The adhesive layer comprises a larger cross-sectional area than the cross-sectional area of each of the first non-conductive ink layer, the second non-conductive ink layer and the electrically conductive layer.

A chip card substrate is provided, which includes a plurality of layers. The plurality of layers includes a first polymer layer including a first polymer material, a second polymer layer disposed over the first polymer layer and a second polymer material different from the first polymer material. The plurality of layers further includes a third polymer layer disposed over the second polymer layer and including the first polymer material. The second polymer layer includes a plurality of cutouts at an edge of the second polymer layer so that the first polymer material of the first polymer layer and of the third polymer layer form a coupling through the plurality of cutouts.

An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided.

A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

A wearable item comprising a conductive transfer applied to a surface of the wearable item is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the two non-conductive ink layers. The transfer also has an adhesive layer which adheres the conductive transfer to the surface of the wearable item. The conductive transfer is configured to withstand elongation such that the resistance of the electrically conductive layer provides a resistance within a pre-specified range.

A method of permanently affixing tungsten cube fragments to the fragmentation warhead in a convex Claymore mine having a plastic case and a housing. Pieces of predetermined sized structural film adhesive are positioned at temperature 60 F.5 F., then pressed into the plastic case while pouring tungsten cubes into the case. The cubes are arranged into desired patterns all at temperature 70 F.2 F. An interface plate and 5 lbs of weight are then placed atop thereof and all are heated in an oven at temperature 205 F.5 F. for four hours for full cure of a desired product.

Coatings comprising functionalized graphene sheets and at least one binder. In one embodiment, the coatings are electrically conductive.

A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.

A surgical buttress for use in a surgical stapling apparatus is provided. The surgical buttress includes an elongate rectangular body portion defining a width; a nose portion integrally formed with and extending from a distal end of the body portion, the nose portion defining a width that is less than the width of the body portion; a neck portion integrally formed with and extending from a distal end of the nose portion, the neck portion defining a width; a head portion integrally formed with and connected to a distal end of the neck portion, the head portion defining a width; and a tail portion integrally formed with and extending from a proximal end of the body portion, the tail portion defining a width that is less that the width of the body portion. The surgical buttress is formed from a material having filaments. The surgical buttress include radioactive material.