Patent classifications
Y10T156/1707
Micro device transfer head assembly
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
MICRO DEVICE TRANSFER HEAD ASSEMBLY
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Laminates, and systems and methods for laminating
A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.
Apparatus for applying self-adhesive labels
An apparatus for applying self-adhesive labels includes a supporting base for at least one reel of a ribbon that supports self-adhesive labels, elements of feeding the ribbon to a head for applying the self-adhesive labels, and a device for taking up the ribbon. The application head can move on command about an orientation axis in order to vary its own direction of extension with respect to the unwinding direction of the ribbon from the reel. The feeder elements include at least one redirection roller, the rotation axis of which can rotate on command, with respect to the reel, about an adjustment axis that is substantially parallel to the orientation axis in order to bring the direction of extension of the ribbon at the application head.
MICRO DEVICE TRANSFER HEAD ASSEMBLY
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Stamp base for a label stamp, and labelling apparatus and method
The present invention relates to a punch foot (1) for a label punch (2) of a device (3) for labeling individual packs (4), having a punch foot housing (5) which in an extent direction (E) extends from a first housing end (5a) having a first housing opening (6a) to a second housing end (5b) having a second housing opening (6b); having a pressure duct (7) which in the punch foot housing (5) extends from the first housing opening (6a) in the extent direction (E); having a perforated plate (8) which closes the second housing opening (6b) and is connected to the punch foot housing (5), by way of which at least one primary nozzle (9) extends in an orientation direction (V); having a pressure chamber (10) which in the punch foot housing (5) extends from the perforated plate (8) counter to the extent direction (E) and which in a manner orthogonal to the extent direction (E) is on all sides delimited by a punch foot housing wall portion (11); having a connection portion (12) which in the punch foot housing (5) in the extent direction (E) extends between the pressure duct (7) and the pressure chamber (10) and which connects the pressure duct (7) to the pressure chamber (10); and having a control element (13) which is disposed in the pressure chamber (10) and which is movable between two terminal positions (I, II) that effect dissimilar flows through the pressure chamber (10); whereby the at least one primary nozzle (9) connects the pressure chamber (10) to the environment of the punch foot housing (5). In order for the handling to be simplified, the invention proposes that at least one secondary nozzle (14) which connects the pressure chamber (10) to the environment of the punch foot housing (5) extends through the punch foot housing wall portion (11) that delimits the pressure chamber (10) on all sides in a manner orthogonal to the extent direction (E). The invention furthermore relates to a device (3) and to a method for labeling individual packs (4).
Micro device transfer head heater assembly and method of transferring a micro device
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
APPARATUS FOR APPLYING SELF-ADHESIVE LABELS
An apparatus for applying self-adhesive labels includes a supporting base for at least one reel of a ribbon that supports self-adhesive labels, elements of feeding the ribbon to a head for applying the self-adhesive labels, and a device for taking up the ribbon. The application head can move on command about an orientation axis in order to vary its own direction of extension with respect to the unwinding direction of the ribbon from the reel. The feeder elements include at least one redirection roller, the rotation axis of which can rotate on command, with respect to the reel, about an adjustment axis that is substantially parallel to the orientation axis in order to bring the direction of extension of the ribbon at the application head.
Laminates, and Systems and Methods for Laminating
A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.
Laminates, and systems and methods for laminating
A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.