Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus 2 is equipped with a loading unit 11, a prepreg sheet conveying unit 12, a leading end position detection unit 13, air spraying units 14, 15, a peeling state detection unit 16, protective sheet gripping/conveying units 17, 18, an extraction unit 19, and a control unit 20. The control apparatus 20 controls the loading unit 11, the prepreg sheet conveying unit 12, the leading end position detection unit 13, the air spraying units 14, 15, the peeling state detection unit 16, the protective sheet gripping/conveying units 17, 18, and the extraction unit 19. The first spraying mechanism 14 sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism 15 sprays second air and fourth air onto the peeling boundary of the protective sheet.

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus 2 is equipped with a loading unit 11, a prepreg sheet conveying unit 12, a leading end position detection unit 13, air spraying units 14, 15, a peeling state detection unit 16, protective sheet gripping/conveying units 17, 18, an extraction unit 19, and a control unit 20. The control apparatus 20 controls the loading unit 11, the prepreg sheet conveying unit 12, the leading end position detection unit 13, the air spraying units 14, 15, the peeling state detection unit 16, the protective sheet gripping/conveying units 17, 18, and the extraction unit 19. The first spraying mechanism 14 sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism 15 sprays second air and fourth air onto the peeling boundary of the protective sheet.

A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

A prepreg sheet attached with a protective sheet is placed on a mounting table to partially overhang. An angle between an edge side direction of an edge section of the mounting table on which overhanging is performed, and a fiber direction of the prepreg sheet, is then set large enough. Overhanging part is physically impacted in a direction to bend fibers of the prepreg sheet to partially peel the protective sheet from the prepreg sheet. A part of the protective sheet peeled from the prepreg sheet is hold and the protective sheet is peeled from an entire surface of the prepreg sheet. A method of peeling a protective sheet from a prepreg sheet more efficiently without damaging the prepreg sheet and an apparatus for peeling to be used therein are provided.

Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus 2 is equipped with a loading unit 11, a prepreg sheet conveying unit 12, a leading end position detection unit 13, air spraying units 14, 15, a peeling state detection unit 16, protective sheet gripping/conveying units 17, 18, an extraction unit 19, and a control unit 20. The control apparatus 20 controls the loading unit 11, the prepreg sheet conveying unit 12, the leading end position detection unit 13, the air spraying units 14, 15, the peeling state detection unit 16, the protective sheet gripping/conveying units 17, 18, and the extraction unit 19. The first spraying mechanism 14 sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism 15 sprays second air and fourth air onto the peeling boundary of the protective sheet.

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.

There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.