A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

A swirler includes an inner body defining a swirl axis. A plurality of swirl vanes extend outward from the inner body. The swirl vanes define respective swirl slots therebetween for imparting swirl on a fluid passing through the swirl slots. A method of making swirlers includes additively manufacturing a stack of swirlers.

A swirler includes an inner body defining a swirl axis. A plurality of swirl vanes extend outward from the inner body. The swirl vanes define respective swirl slots therebetween for imparting swirl on a fluid passing through the swirl slots. A method of making swirlers includes additively manufacturing a stack of swirlers.

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

A method is provided for producing chain link plates for a plate link chain with alternating inner chain links and outer chain links, where the contour of the chain link plates has several punch sections and two face side and rear side contact sections which, after punching out the punch sections from the sheet metal strip provided, are first connected to complementary contact sections of adjoining chain link plates and separated in a subsequent separation cut. Further provided are bush or roller chains with outer chain link plates thus produced and a corresponding chain drive for an internal combustion engine with such a bush or roller chain. The method comprises the steps of: providing a sheet metal strip, punching out the punch sections of the chain link plates from the sheet metal strip, where a further rear side contact section, in addition to the face side contact sections, is respectively connected at the head portions of the chain link plates to a complementary contact section of adjoining chain link plates, and separating the face side contact sections and the rear side contact sections of the head portions of the chain link plates by way of a substantially waste-free separation cut.

A method of forming a fracture start portion of a con rod for forming fracture start portions of a con rod at opposing positions in an inner peripheral surface of a large end of the con rod made of metal, includes a first step of forming a groove portion at a position corresponding to the fracture start portion by using a first insert tip with a large tip end and a second step of forming the fracture start portion, which has become a V-shaped groove, by machining a bottom portion of the groove portion smaller by using a second insert tip having a tip end smaller than the first insert tip.

A method is provided for producing chain link plates for a plate link chain with alternating inner chain links and outer chain links, where the contour of the chain link plates has several punch sections and two face side and rear side contact sections which, after punching out the punch sections from the sheet metal strip provided, are first connected to complementary contact sections of adjoining chain link plates and separated in a subsequent separation cut. Further provided are bush or roller chains with outer chain link plates thus produced and a corresponding chain drive for an internal combustion engine with such a bush or roller chain. The method comprises the steps of: providing a sheet metal strip, punching out the punch sections of the chain link plates from the sheet metal strip, where a further rear side contact section, in addition to the face side contact sections, is respectively connected at the head portions of the chain link plates to a complementary contact section of adjoining chain link plates, and separating the face side contact sections and the rear side contact sections of the head portions of the chain link plates by way of a substantially waste-free separation cut.

A method and device for manufacturing turbine blades (5; 7; 28; 33) made of a metal alloy. Starting with aluminum and titanium alloy bar (10; 34) having a simple and/or axisymmetric shape, at least two mutually interlocking blanks (2; 3; 4; 8; 11) are produced in the bar (10; 34) by waterjet cutting (16) and then each one of the blanks (2; 3; 4; 8; 11) thus obtained is machined separately in order to obtain the blades (5; 7; 28; 33) having a final profile.

A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent.