Embodiments of the present disclosure generally provide a cutting die system. The cutting die system includes a substrate, at least one blade, and an ejector coupled to the substrate. The ejector includes a compressible portion having a top surface and a bottom surface opposite the top surface. The bottom surface is coupled to the substrate and a protective layer is cured to the top surface. A method of die cutting a blank according to an embodiment of the present disclosure includes directing a blank between a cutting die and an anvil, the cutting die comprising a substrate. An ejector coupled to the substrate is compressed between the cutting die and the blank. A scrap piece is cut from the blank as it passes between the cutting die and the anvil, and the scrap piece is ejected by releasing the compressed ejector.