A method and a cutting system for sheets includes a cutting center, a sorting apparatus with handlers for gripping pieces cut by the cutting center, and a transfer board, movable between the handler area and the inside of the cutting center, supporting the sheets. The cutting center includes a cutting head movably mounted above the transfer board with a distance detection sensor, detecting distance data with respect to a sheet on the transfer board. The cutting center and sorting apparatus have respective first and second control logics. A data interface unit lies between the first and second control logic, by which distance data from the distance detection sensor, are transferred. The second control logic has a processor defining, periodically during operation cycles, an altitude map based on the distance data detected in a number of positions, and controlling a gripping step of the handlers based on the altitude map.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

A unit for applying first and second tabs, obtained from first and second webs, to a chassis web includes an applicator drum rotatable about an axis and including a main body. A plurality of carriers is movable between a lowered position close to the axis and a raised position away from the axis, each including a suction portion. A first carrier first suction and non-suction portions aligned along the axis. A second carrier includes second suction and non-suction portions aligned along the axis. The first suction portions alternate with the second non-suction portions and the first non-suction portions alternate with the second suction portions. A first system holds the first web on the applicator drum upstream of a cutting device. A second system holds the second web on the drum upstream of the cutting device.

A method and a cutting system for sheets includes a cutting center, a sorting apparatus with handlers for gripping pieces cut by the cutting center, and a transfer board, movable between the handler area and the inside of the cutting center, supporting the sheets. The cutting center includes a cutting head movably mounted above the transfer board with a distance detection sensor, detecting distance data with respect to a sheet on the transfer board. The cutting center and sorting apparatus have respective first and second control logics. A data interface unit lies between the first and second control logic, by which distance data from the distance detection sensor, are transferred. The second control logic has a processor defining, periodically during operation cycles, an altitude map based on the distance data detected in a number of positions, and controlling a gripping step of the handlers based on the altitude map.

A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

A cutting device for a machine tool, suitable for mounting on the spindle support structure of a machine tool for processing and cutting materials, incorporates suckers able to cause the device to adhere to and be fixed to the materials being machined. Further, a cutting head having a protection device with incorporated suckers, a cutting spindle having a protection device with incorporated suckers and a machine for machining the materials, having a cutting spindle incorporating suckers.

A unit for applying first and second tabs, obtained from first and second webs, to a chassis web includes an applicator drum rotatable about an axis and including a main body. A plurality of carriers is movable between a lowered position close to the axis and a raised position away from the axis, each including a suction portion. A first carrier first suction and non-suction portions aligned along the axis. A second carrier includes second suction and non-suction portions aligned along the axis. The first suction portions alternate with the second non-suction portions and the first non-suction portions alternate with the second suction portions. A first system holds the first web on the applicator drum upstream of a cutting device. A second system holds the second web on the drum upstream of the cutting device.

The present disclosure is directed, in part, to a cutting apparatus comprising a drive shaft having a longitudinal axis, a drum configured to orbit the longitudinal axis when driven by the drive shaft, a first actuator, and a cutting assembly joined to the drum and configured to orbit the longitudinal axis with the drum. The cutting assembly comprises a second actuator operably engaged with a portion of the cutting assembly, and a cutting device driven by the second actuator. The second actuator is configured to rotate the cutting device at least 1,500 revolutions per minute during cutting of an article. The first actuator is operably engaged with a portion of the cutting assembly and is configured to reciprocate the cutting device in directions substantially parallel to the longitudinal axis as the cutting assembly orbits the longitudinal axis.

A method of discharging workpieces cut from a planar material on a processing machine. A workpiece discharge device has several holding elements to receive and carry respective workpieces. After receiving a cut workpiece, the discharge device is moved to a waiting position outside and adjacent a processing region of the machine, and may then be moved back into the processing region to receive a subsequently cut workpiece before being moved to an unloading station.